Semiconductor device with pre-molding chip bonding
View Patent ↗This disclosure relates generally to a semiconductor device and method of making the semiconductor device by pressing an electrical contact of a chip into a bonding layer on a carrier. The bonding layer is cured and coupled, at least in part, to the electrical contact. A molding layer is applied in contact with the chip and a first major surface of the bonding layer. Distribution circuitry is coupled to the electrical contact.
1. A semiconductor device, comprising:
a carrier layer;
a substantially flat bonding layer having a material reactivity of less than approximately one percent;
a debondable adhesive layer positioned between the carrier layer and the bonding layer, the carrier layer and the bonding layer being adhesively coupled to the adhesive layer; and
a chip comprising an electrical contact buried into the bonding layer.
2. The semiconductor device of claim 1 , wherein the adhesive layer is configured to release the carrier layer with respect to the bonding layer upon the adhesive layer being debonded.
3. The semiconductor device of claim 2 , wherein the debondable adhesive layer comprises one of a thermo-releasable adhesive and an ultra-violet-releasable adhesive configured to debond upon application of at least one of heat and ultra-violet energy.
4. The semiconductor device of claim 1 , wherein the chip comprises a plurality of electrical contacts each having approximately two (2) micrometers of separation between one another.
5. The semiconductor device of claim 1 , wherein the bonding layer is a polyamide epoxy.
6. A semiconductor device, comprising:
a carrier layer;
a substantially flat bonding layer having a material reactivity of less than approximately one percent;
a debondable adhesive layer positioned between the carrier layer and the bonding layer, the carrier layer and the bonding layer being adhesively coupled to the adhesive layer;
a chip comprising an electrical contact buried into the bonding layer; and
a buildup layer on a second major surface of the bonding layer opposite the first major surface and substantially surrounding the distribution circuitry.
7. The semiconductor device of claim 6 , further comprising solder bumps coupled to the distribution circuitry, wherein the buildup layer secures, in part, the solder bumps.
8. The semiconductor device of claim 6 , wherein the adhesive layer is configured to release the carrier layer with respect to the bonding layer upon the adhesive layer being debonded.
9. The semiconductor device of claim 6 , wherein the debondable adhesive layer comprises one of a thermo-releasable adhesive and an ultra-violet-releasable adhesive configured to be debonded upon application of at least one of heat and ultra-violet energy.
10. The semiconductor device of claim 6 , wherein the chip comprises a plurality of electrical contacts each having approximately two (2) micrometers of separation between one another.
11. The semiconductor device of claim 6 , wherein the bonding layer is a polyamide epoxy.