IP Library › Granted Patent US 9,401,357
Granted Patent B2
US 9,401,357 · App. 14/498,322 · Granted Jul 26, 2016

Directional FinFET capacitor structures

Inventor: Hong Chun (San Diego, CA)
Assignee: QUALCOMM INCORPORATED
H01L27/0629H01L23/5223H01L27/0805H01L28/60H01L28/86H01L29/785H01L2924/0002
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Quick Facts
Patent No.
US 9,401,357
App. No.
14/498,322
Granted
Jul 26, 2016
Kind
B2
Abstract

A method for fabricating a capacitor within a FinFET device includes patterning a first gate interconnect material having a first recess. The method also includes patterning a first trench interconnect material coupled to the first gate interconnect material at the first recess to form a first plate of a FinFET capacitive structure.

Claims (17)

1. A capacitor within a FinFET device, comprising:

a first gate interconnect material having a first recess;

a first stacked trench interconnect material coupled to the first gate interconnect material at the first recess to form a first plate of a FinFET capacitive structure;

a second gate interconnect material having a second recess; and

a second stacked trench interconnect material coupled to the second gate interconnect material at the second recess to form a second plate of the FinFET capacitive structure.

2. The capacitor of claim 1 , in which the first gate interconnect material, the second gate interconnect material, the first stacked trench interconnect material and the second stacked trench interconnect material are arranged in a ring structure.

3. The capacitor of claim 1 , in which the first gate interconnect material, the second gate interconnect material, the first stacked trench interconnect material and the second stacked trench interconnect material are arranged in an interwoven finger structure.

4. The capacitor of claim 1 , in which the first gate interconnect material, the second gate interconnect material, the first stacked trench interconnect material and the second stacked trench interconnect material are arranged in an array of striped structures.

5. The capacitor of claim 1 , in which a polysilicon region forms at least a portion of the second plate of the FinFET capacitive structure.

6. The capacitor of claim 1 , in which the second plate of the FinFET capacitive structure is proximate an active region of the FinFET device.

7. The capacitor of claim 1 integrated into a mobile phone, a set top box, a music player, a video player, an entertainment unit, a navigation device, a computer, a hand-held personal communication systems (PCS) unit, a portable data unit, and/or a fixed location data unit.

8. A device including capacitive structures in a FinFET device, comprising:

first means for interconnecting a first gate having a first recess;

first means for interconnecting to the first gate interconnecting means at the first recess to form a first plate of a FinFET capacitive structure;

second means for interconnecting a second gate having a second recess; and

second means for interconnecting to the second gate interconnecting means at the second recess to form a second plate of the FinFET capacitive structure.

9. The device of claim 8 integrated into a mobile phone, a set top box, a music player, a video player, an entertainment unit, a navigation device, a computer, a hand-held personal communication systems (PCS) unit, a portable data unit, and/or a fixed location data unit.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 13, 2014
From: CHUN, HONG
To: QUALCOMM INCORPORATED
Reel/Frame 034168/0911 →
Continuity (3)
Provisional Application 61946553 · Feb 28, 2014
Provisional Application 61946628 · Feb 28, 2014
Related Publication 20150249081A1 · Sep 3, 2015