Apparatus and method of manufacturing fin-FET devices
A method of manufacturing a Fin-FET device includes forming a plurality of fins in a substrate, which the substrate includes a center region and a periphery region surrounding the center region. A gate material layer is deposited over the fins, and the gate material layer is etched with an etching gas to form gates, which the etching gas is supplied at a ratio of a flow rate at the center region to a flow rate at the periphery region in a range from 0.33 to 3.
1. A method of manufacturing a Fin-FET device, comprising
forming a plurality of fins from a substrate, wherein the substrate comprises a center region and a periphery region surrounding the center region;
depositing a gate material layer over the fins; and
supplying a first flow of an etching gas to the center region; and
supplying a second flow of the etching gas to the periphery region to form notched gates respectively at the center region and the periphery region, wherein the etching gas is supplied at a ratio of a flow rate of the first flow to a flow rate of the second flow in a range from 0.33 to 3.
2. The method of claim 1 , wherein each of the notched gates has a first portion disposed above the fin and a second portion overlapped with the sidewalls of the fin.
3. The method of claim 2 , wherein the second portion comprises:
a first width at a boundary of the first portion and the second portion; and
a second width at a bottom of the notched gate, wherein the second width is smaller than the first width.
4. The method of claim 3 , further comprising a third width between the first width and the second width, wherein the third with is smaller than the second width.
5. The method of claim 1 , wherein the etching gas is hydrogen bromide or oxygen.
6. The method of claim 1 , farther comprising growing an epitaxial structure in the fin.
7. The method of claim 6 , wherein the epitaxial structure is formed of SiGe.
8. The method of claim 6 , wherein a proximity distance between the epitaxial structure and each of the notched gates Is in a range from about 0.5 nm to about 10 nm.
9. The method of claim 1 , wherein the etching gas is supplied at the ratio of the flow rate at the center region to the flow rate at the periphery region in a range from 1 to 1.1.
10. The method of claim 1 , wherein depositing the gate material layer over the fins comprises:
forming a gate oxide layer over the fins;
forming a gate layer on the gate oxide layer; and
forming a hard mask layer on the gate layer.
11. A method of manufacturing a Fin-FET device, comprising:
forming a plurality of fins from a substrate, wherein the substrate comprises a center region and a periphery region surrounding the center region;
depositing a gate material layer over the fins;
supplying a first flow of an etching gas to the center region;
supplying a second flow of the etching gas to the periphery region; and
forming notched gates from the etched gate material layer by supplying the etching gas at a ratio of a flow rate of the first flow to a flow rate of the second flow in a range from 0.33 to 3, wherein the notched gates have a first portion disposed above the fin and a second portion overlapped with the sidewalls of the fin, wherein the second portion comprises:
a first width at a boundary of the first portion and the second portion;
a second width at a bottom of the gate;
a third width between the first width and the second width, wherein the third width is smaller than the first width and the second width; and
a first distance from the second width to the third width.
12. The method of claim 11 , wherein the etching gas is hydrogen bromide or oxygen.
13. The method of claim 11 , wherein the second width is smaller than the first width.
14. The method of claim 11 , further comprising growing an epitaxial structure in the fin.
15. The method of claim 14 , wherein a proximity distance between the epitaxial structure and the gate is in a range from about 0.5 nm to about 10 nm.
16. The method of claim 14 , wherein the third width and a vertex of an angle of the epitaxial structure is on a same line.
17. The method of claim 16 , wherein the first distance from the second width to the third width of the gate in the periphery region is decreased by decreasing the ratio.
18. The method of claim 11 , wherein the etching gas is supplied at the ratio of the flow rate at the center region to the flow rate at the periphery region in a range from 1 to 1.1.
19. The method of claim 11 , wherein the first distance from the second width to the third width of the gate in the center region is increased by decreasing the ratio.