Semiconductor devices with sidewall spacers of equal thickness
Semiconductor structures with different devices each having spacers of equal thickness and methods of manufacture are disclosed. The method includes forming a first gate stack and a second gate stack. The method further includes forming sidewall spacers of equal thickness for both the first gate stack and the second gate stack by depositing a liner material over spacer material on sidewalls of the first gate stack and the second gate stack and within a space formed between the spacer material and source and drain regions of the first gate stack.
1. A method, comprising:
forming a first gate stack and a second gate stack;
forming a spacer material over the first gate stack and the second gate stack;
forming source and drain regions abutting the spacer material of the first gate stack;
creating a space between the source and drain regions and the spacer material of the first gate stack by a thinning process of the spacer material;
forming sidewall spacers of equal thickness for both the first gate stack and the second gate stack by depositing a liner material over the spacer material on sidewalls of the first gate stack and the second gate stack and within the space formed between the spacer material and source and drain regions of the first gate stack, wherein a portion of the spacer material formed over the second gate stack is not covered by the liner material; and
forming source and drain regions directly abutting sidewalls of the liner material of the second gate stack and the portion of the spacer material formed over the second gate stack which is not covered by the liner material.
2. The method of claim 1 , wherein the first gate stack and the second gate stack are formed over a plurality of fin structures.
3. The method of claim 1 , wherein the first gate stack is a PFET and the second gate stack is an NFET.
4. The method of claim 1 , wherein forming of the space between the source and drain regions and the spacer material of the first gate stack comprises thinning the spacer material on sidewalls of the first gate stack and the second gate stack by an isotropic etching process.
5. The method of claim 4 , wherein the isotropic etching process comprises one of:
a chemistry of hydrofluoric ethylene glycol (HFEG) which is selective to SiN based spacer material;
an HF-based wet chemistry for wet isotropic processes; and
an isotropic dry etch process used with NF3/NH3 or NH3/HF based reactants.
6. The method of claim 1 , wherein the space has a width dependent on a thickness of the liner material.
7. The method of claim 1 , wherein the forming of the sidewall spacers comprises:
blanket depositing the spacer material over the first gate stack and the second gate stack;
forming the source and drain regions abutting the spacer material of the first gate stack;
thinning of the spacer material over the first gate stack and the second gate stack which creates the space between the source and drain regions and the spacer material of the first gate stack;
depositing the liner material over the spacer material of the first gate stack and the second gate stack, including within the space; and
removing the liner material and the spacer material formed on a substrate adjacent to the second gate stack.
8. The method of claim 1 , wherein the spacer material is provided in a blanket deposition process to a thickness of about 3 nm to 15 nm and the liner material is provided in a blanket deposition process to a thickness of about 1 nm to 5 nm.
9. The method of claim 1 , further comprising forming source and drain regions for the second gate stack, abutting the sidewall spacers of the second gate stack, wherein the source and drain regions of the first gate stack and the second gate stack are formed by an epitaxial growth process of semiconductor material, which is doped in-situ.
10. The method of claim 1 , wherein the thinning of the spacer material provides the space such that the source and drain regions do not contact the spacer material of the first gate stack.
11. A method, comprising:
forming a first gate stack and a second gate stack;
forming a spacer material over the first gate stack and the second gate stack;
forming source and drain regions abutting the spacer material of the first gate stack;
creating a space between the source and drain regions and the spacer material of the first gate stack such that the source and drain regions do not contact the spacer material of the first gate stack;
depositing a liner material over the spacer material of the first gate stack and the second gate stack and within the space between the source and drain regions and the spacer material of the first gate stack to form sidewall spacers of equal thickness for both the first gate stack and the second gate stack;
removing the liner material and the spacer material on a surface adjacent to the second gate stack, such that a portion of the spacer material formed over the second gate stack is not covered by the liner material; and
forming source and drain regions directly abutting sidewalls of the liner material of the second gate stack and the portion of the spacer material formed over the second gate stack which is not covered by the liner material.
12. The method of claim 11 , wherein the first gate stack and the second gate stack are formed over a plurality of fin structures.
13. The method of claim 11 , wherein the first gate stack is a PFET and the second gate stack is an NFET.
14. The method of claim 11 , wherein the forming of the space between the source and drain regions and the spacer material of the first gate stack comprises thinning the spacer material on sidewalls of the first gate stack by an isotropic etching process.
15. The method of claim 14 , wherein the isotropic etching process comprises one of:
a chemistry of hydrofluoric ethylene glycol (HFEG) which is selective to SiN based material;
an HF-based wet chemistry for wet isotropic processes; and
an isotropic dry etch process used with NF3/NH3 or NH3/HF based reactants.
16. The method of claim 11 , wherein sidewall spacers of the first gate stack and the second gate are of equal thickness.
17. The method of claim 16 , wherein forming of the sidewall spacers of the first gate stack and the second gate comprises:
blanket depositing the spacer material over the first gate stack and the second gate stack;
thinning of the spacer material over the first gate stack and the second gate stack which creates the space between the source and drain regions and the spacer material of the first gate stack; and
depositing the liner material over the spacer material of the first gate stack and the second gate stack, including within the space.
18. The method of claim 17 , wherein the spacer material is provided in a blanket deposition process to a thickness of about 3nm to 15 nm and the liner material is provided in a blanket deposition process to a thickness of about 1 nm to 5 nm.
19. The method of claim 18 , wherein the thickness of the liner material is equal to a width dimension of the space.
20. The method of claim 16 , further comprising forming source and drain regions for the second gate stack, abutting the sidewall spacers of the second gate stack, wherein the source and drain regions of the first gate stack and the second gate stack are formed by an epitaxial growth process of semiconductor material, which is doped in-situ.