IP Library › Granted Patent US 9,470,839
Granted Patent B2
US 9,470,839 · App. 14/509,782 · Granted Oct 18, 2016

Light source module and backlight unit including the same

Inventors: Byoung Dae Ye (Yongin-si, KR); Young Chun Kim (Seoul, KR); Hyuk Hwan Kim (Hwaseong-si, KR)
Assignee: Samsung Display Co., Ltd.
G02B6/0073G02B6/0031H01L33/50H01L33/60G02B6/009G02B6/0078G02B6/0083H01L33/46
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Quick Facts
Patent No.
US 9,470,839
App. No.
14/509,782
Granted
Oct 18, 2016
Kind
B2
Abstract

Provided are a light source module and a backlight unit. According to an embodiment, the light source module comprises a circuit board, at least one LED chip electrically connected onto the circuit board, a reflective surface on an upper surface of the LED chip configured to reflect light, and a fluorescent surface on at least one side surface of the LED chip configured to emit the light.

Claims (40)

1. A light source module comprising:

a circuit board;

at least one light emitting diode (LED) chip electrically connected onto the circuit board and configured to emit light;

a reflective surface on and directly contacting an upper surface of the LED chip configured to reflect the entire light incident to the reflective surface; and

a fluorescent surface on at least one side surface of the LED chip.

2. The light source module of claim 1 , wherein the reflective surface is arranged in parallel to the circuit board, and

a horizontal cross section of the reflective surface includes a horizontal cross section of the LED chip.

3. The light source module of claim 1 , wherein the LED chip and the circuit board are electrically connected to each other by a bump electrode.

4. The light source module of claim 1 , wherein the LED chip includes four side surfaces, and

the light source module further comprises a side reflective surface on at least one side surface of the LED chip configured to reflect the light.

5. The light source module of claim 4 , wherein the fluorescent surface is on three side surfaces of the LED chip.

6. The light source module of claim 4 , wherein the fluorescent surface is on two side surfaces of the LED chip, and

the side reflective surface is on two side surfaces that are different from the side surface on which the fluorescent surface is on.

7. The light source module of claim 4 , wherein the fluorescent surface is on one side surface of the LED chip, and

the side reflective surface is on three side surfaces that are different from the side surface on which the fluorescent surface is on.

8. The light source module of claim 1 , further comprising a bottom reflective surface interposed between the LED chip and the circuit board configured to reflect the light.

9. The light source module of claim 8 , wherein the bottom reflective surface includes an area of a bottom surface of the LED chip.

10. A backlight unit comprising:

a light guide panel;

at least one light emitting element arranged on a side surface of the light guide panel configured to generate light; and

a circuit board electrically connected to the light emitting element,

wherein the light emitting element includes a light emitting diode (LED) chip configured to emit the light, a reflective surface on and directly contacting an upper surface of the LED chip configured to reflect the entire light incident to the reflective surface, and a fluorescent surface on at least one side surface of the LED chip.

11. The backlight unit of claim 10 , wherein the LED chip and the circuit board are electrically connected to each other by a bump electrode.

12. The backlight unit of claim 10 , wherein the reflective surface is arranged in parallel to the circuit board, and

a horizontal cross section of the reflective surface includes a horizontal cross section of the LED chip.

13. The backlight unit of claim 10 , wherein the LED chip includes four side surfaces, and

the backlight unit further comprises a side reflective surface on at least one side surface of the LED chip configured to reflect the light.

14. The backlight unit of claim 13 , wherein the side reflective surface is on an opposite side surface to the side surface of the LED chip that faces the light guide panel.

15. The backlight unit of claim 14 , wherein the side reflective surface includes an area of the side surface of the LED chip where the side reflective surface is on.

16. The backlight unit of claim 14 , wherein the fluorescent surface is on three side surfaces that are different from the side surface where the side reflective surface is on.

17. A backlight unit comprising:

a first light guide panel;

a second light guide panel;

at least one light emitting element arranged between the first light guide panel and the second light guide panel configured to generate light; and

a circuit board electrically connected to the light emitting element,

wherein the light emitting element includes a light emitting diode (LED) chip configured to emit the light, a reflective surface on and directly contacting an upper surface of the LED chip configured to reflect the entire light incident to the reflective surface, and a fluorescent surface on at least one side surface of the LED chip.

18. The backlight unit of claim 17 , wherein the LED chip and the circuit board are electrically connected to each other by a bump electrode.

19. The backlight unit of claim 17 , wherein the LED chip includes four side surfaces, and

the fluorescent surface is on the surface of the LED chip that faces the first light guide panel and the surface of the LED chip that faces the second light guide panel.

20. The backlight unit of claim 17 , further comprising a bottom reflective surface interposed between the LED chip and the circuit board configured to reflect the light.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 8, 2014
From: YE, BYOUNG DAE; KIM, YOUNG CHUN; KIM, HYUK HWAN
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 033914/0894 →
Priority Claims (1)
KR 10-2014-0075042 · Jun 19, 2014 · national
Continuity (1)
Related Publication 20150369997A1 · Dec 24, 2015