Active, micro-well thermal control subsystem

1. A method of providing active thermal control of a sample-holding device in a thermal control subsystem, the method comprising:

coupling the sample-holding device to a fluidic circuit;

pumping a heat-transferring fluid through the fluidic circuit for selectively heating or cooling a sample within the sample-holding device under the control of a controller;

thermally-coupling a first assembly, including a controllable first thermo-electric device, a first heat removal device, and a first heat spreader to a first side of said sample-holding device, wherein the first assembly is in a thermal communication with the heat transferring fluid within the fluidic circuit;

thermally-coupling a second assembly, including a controllable second thermo-electric device and a second heat removal device to a second, opposing side of said sample-holding device, wherein the second assembly is in thermal communication with the heat transferring fluid within the fluidic circuit;

at least a some times, removing heat from the heat-transferring fluid in the fluidic circuit using at least one of said first and second heat removal devices and a heat exchanger disposed in the fluidic circuit; and

at least at some times selectively controlling at least one of the first and second thermo-electric devices associated with the first and second assemblies to remove heat from, or add heat to, said sample-holding device under the control of the controller.

2. The method as recited in claim 1 , wherein controlling the first and second thermo-electric devices associated with the first and second assemblies includes selectively controlling current and voltage polarity to at least one of the thermo-electric devices under the control of the controller, to transfer heat across the at least one of the thermo-electric devices bi-directionally and thereby transfer heat to or remove heat from the sample-holding device.

3. The method of claim 2 wherein the first and second thermo-electric devices comprise peltier effect devices.

4. The method of claim 1 including the step of removing heat from the heat transferring fluid with the heat exchanger within the fluidic circuit, wherein the step of removing heat from the heat transferring fluid with the heat exchanger includes pumping the heat transferring fluid through at least one coil within the heat exchanger and moving ambient air across the at least one coil via at least one fan assembly.

5. The method of claim 1 wherein the thermal control subsystem further includes a reagent-containing device in thermal communication with the heat transferring fluid within the fluidic circuit, the method further including the step of heating a reagent within the reagent-containing device by controlling at least one the first and second thermo-electric devices in thermal communication with the heat transferring fluid within the fluidic circuit to heat the heat transferring fluid and, pumping the heated heat transferring fluid through the fluidic circuit to heat the reagent within the reagent-containing device.

6. The method of claim 1 wherein the thermal control subsystem further includes a reagent-containing device in thermal communication with the fluidic circuit, the method further including the step of cooling a reagent within the reagent-containing device by:

controlling at least one the first and second thermo-electric devices in thermal communication with the heat transferring fluid within the fluidic circuit to cool the heat transferring fluid and, pumping the cooled heat transferring fluid through the fluidic circuit to cool the reagent within the reagent-containing device; or

pumping the heat transferring fluid within the fluidic circuit through at least one coil within a heat exchanger and through the reagent-containing device and moving ambient air across the at least one coil via at least one fan assembly under the control of the controller at a time when the ambient air is cooler than the heat transferring fluid.

7. The method of claim 1 wherein the second assembly includes a second heat spreader and the step of thermally-coupling the second assembly to the second, opposing side of said sample-holding device includes the step of thermally-coupling the second assembly, including the controllable second thermo-electric device, the second heat removal device and the second heat spreader to the second, opposing side of said sample-holding device.

8. The method of claim 1 wherein the second assembly includes a second heat spreader, the thermal control subsystem includes a plurality of sample-holding devices in thermal communication with the first and second heat spreaders, and the thermal control subsystem includes first and second pluralities of thermo-electric devices corresponding in number to the plurality of sample-holding devices in respective first and second assemblies, the first and second pluralities of thermo-electric devices being in thermal communication with respective first and second heat spreaders, the method including maintaining adjacent sample-holding devices within ±0.5° C. of one another.

9. The method of claim 1 wherein the second assembly includes a second heat spreader, the thermal control subsystem includes a plurality of sample-holding devices in thermal communication with the first and second heat spreaders, and the thermal control subsystem includes first and second pluralities of thermo-electric devices corresponding in number to the plurality of sample-holding devices in respective first and second assemblies, the first and second pluralities of thermo-electric devices being in thermal communication with respective first and second heat spreaders, the method including the step of controlling the pumping of the heat-transferring fluid within the fluidic circuit, controlling the first and second pluralities of thermo-electric devices and controlling the heat exchanger with the controller to ramp the temperature of the sample-holding device for at least one of heating and cooling at a rate between 1° C. and 10° C. per minute.