IP Library › Patent Application 14513421
Patent Application
App. No. 14/513,421

METHOD OF MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD

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Quick Facts
Patent No.
US None
App. No.
14/513,421
Abstract

A method of manufacturing a rigid-flexible printed circuit board, which including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.

Claims (22)

1 . A method of manufacturing a rigid-flexible printed circuit board, which comprises:

providing a first flexible film having a first metal layer on one or both surfaces;

forming a circuit pattern by patterning the first metal layer;

forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film;

forming a circuit pattern by patterning the second metal layer in a rigid domain R;

providing an anti-oxidation protective layer on the second metal layer in a flexible domain F;

laminating at least one circuit layer on the second flexible film; and

removing the circuit layer in the flexible domain F.

2 . The method of manufacturing a rigid-flexible printed circuit board according to claim 1 , wherein the anti-oxidation protective layer is removed in removing the circuit layer in the flexible domain F.

3 . The method of manufacturing a rigid-flexible printed circuit board according to claim 1 , wherein the second metal layer corresponding to the flexible domain F is removed in removing the circuit layer in the flexible domain F.

4 . The method of manufacturing a rigid-flexible printed circuit board according to claim 1 , further comprising:

attaching a bonding sheet between the second metal layer and the anti-oxidation protective layer.

5 . The method of manufacturing a rigid-flexible printed circuit board according to claim 1 , wherein the anti-oxidation protective layer is made of an adhesive material including polyimide.

6 . The method of manufacturing a rigid-flexible printed circuit board according to claim 1 , wherein providing the anti-oxidation protective layer on the second metal layer in the flexible domain F is performed by applying slurry, which is made of an adhesive material including polyimide, on the second metal layer corresponding to the flexible domain F; and

curing the slurry.

7 . The method of manufacturing a rigid-flexible printed circuit board according to claim 1 , further comprising:

providing a bonding sheet between the first flexible film and the second flexible film.

8 . The method of manufacturing a rigid-flexible printed circuit board according to claim 1 , wherein laminating the at least one circuit layer on the second flexible film laminates the circuit layer after oxidizing the circuit pattern under the circuit layer.

9 . The method of manufacturing a rigid-flexible printed circuit board according to claim 8 , wherein the circuit layer is formed by forming an insulating layer which covers the circuit pattern under the circuit layer; forming a metal layer on the insulating layer; and forming a circuit pattern by patterning the metal layer.

10 . The method of manufacturing a rigid-flexible printed circuit board according to claim 9 , wherein in forming the circuit pattern by patterning the metal layer, the metal layer in the flexible domain F is removed.

11 . The method of manufacturing a rigid-flexible printed circuit board according to claim 1 , wherein removing the circuit layer in the flexible domain F is performed by a CO 2 laser drilling process or a YAG laser drilling process.

12 . The method of manufacturing a rigid-flexible printed circuit board according to claim 11 , wherein before the laser drilling process, a flexible domain F portion of the metal layer included in the uppermost circuit layer is removed.