IP Library Granted Patent US 10,214,817
Granted Patent B2
US 10,214,817 · App. 14/515,135 · Granted Feb 26, 2019

Multi-metal films, alternating film multilayers, formation methods and deposition system

Inventors: Christos G. Takoudis (Chicago, IL); Manish Singh (Chicago, IL); Sathees Kannan Selvaraj (Chicago, IL)
Assignee: The Board of Trustees of the University of Illinois
C23C16/52C23C16/406C23C16/45523C23C16/45544C23C16/45553C23C16/45561
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Quick Facts
Patent No.
US 10,214,817
App. No.
14/515,135
Granted
Feb 26, 2019
Kind
B2
Abstract

A deposition system can conduct ALD or CVD deposition and can switch between the deposition modes. The system is capable of depositing multi-metal films and multi-layer films of alternating ALD and CVD films. Reactant supplies can be bypassed with carrier gas flow to maintain pressure in a reactor and in reactor supply lines and purge reactants.

Claims (35)

1. A deposition system comprising:

a reactor chamber;

a plurality of reactant supply vessels;

a carrier gas supply; and

a supply line and valve set, the valve set including a plurality of actuated valves being arranged to selectively bypass the plurality of reactant supply vessels and deliver carrier gas to the reactor chamber or carry reactant from the plurality of reactant supply vessels to the reactor chamber by operating at least two valves of the plurality of actuated valves in tandem,

the plurality of actuated valves being arranged such that each respective reactant supply vessel has an associated bypass valve connected between an upstream precursor supply valve disposed upstream of the respective reactant supply vessel and a downstream precursor supply valve disposed downstream of the respective reactant supply vessel, the upstream and downstream precursor supply valves controlling flow of carrier gas through the respective reactant supply vessel to establish a precursor supply path of carrier gas through the upstream precursor supply valve, the respective reactant supply vessel, the downstream precursor supply valve and to the reactor chamber and a bypass path of carrier gas through the associated bypass valve to the reactor chamber to bypass the respective reactant supply vessel;

a secondary supply line connected via an actuated switching valve to reactant gas and inert gas supplies;

a controller configured to control at least the upstream and downstream valves of the plurality of actuated valves in tandem and the associated bypass valve to selectively bypass one or both of reactant supplies and deliver reactant from one or both of the reactant supplies via an associated bypass path or precursor supply path;

a first control software executable by the controller to control the plurality of actuated valves and the actuated switching valve in a first predetermined sequence to conduct CVD (chemical vapor deposition), wherein the first predetermined sequence comprises opening and closing the upstream and downstream precursor supply valves, opening and closing the associated bypass valve, and opening and closing the actuated switching valve; and

a second control software executable by the controller to control the plurality of actuated valves and the actuated switching valve in a second predetermined sequence to conduct ALD (atomic layer deposition), wherein the second predetermined sequence comprises opening and closing the upstream and downstream precursor supply valves, opening and closing the associated bypass valve and opening and closing the actuated switching valve.

2. The system according to claim 1 , wherein the valve set provides three operational flow states that consist of flow through bypass path, flow through the precursor supply path, and no flow.

3. The system according to claim 2 , wherein the valve set further comprises auxiliary valves to isolate reactant during installation, removal or changing of a corresponding supply vessel.

4. The system according to claim 1 , wherein the valve set further comprises auxiliary valves to isolate reactant during installation, removal or changing of a corresponding supply vessel.

5. The system according to claim 1 , further comprising an interconnect supply line valve upstream of the reactant supplies that connects supply lines of two of the plurality of reactant supply vessels.

6. The system according to claim 1 , wherein the valve set includes a common bypass valve that provides a bypass of two of the plurality of reactant supplies.

7. The system according to claim 1 , wherein the valve set provides a separate bypass around each of the plurality of reactant supply vessels.

8. The system according to claim 1 , further comprising:

a third control software executable by the controller to control the plurality of actuated valves and the actuated switching valve in a third sequence to sequentially conduct CVD and ALD deposition cycles, wherein the third predetermined sequence comprises opening and closing the upstream and downstream precursor supply valves, opening and closing the associated bypass valve, and opening and closing the actuated switching valve.

9. The system according to claim 1 , wherein the first control software is executable by the controller to conduct the CVD cycle according to the first sequence by simultaneously flowing two reactants from a plurality of the reactant supplies to the reactor chamber.

10. The system according to claim 1 , wherein the second control software is executable by the controller to conduct the ALD cycle according to the second sequence by sequentially flowing two reactants from a plurality of the reactant supplies to the reactor chamber with an intervening purge cycle between the sequentially flowing.

11. The system according to claim 1 , wherein the plurality of reactant supply vessels comprises at least four reactant supply vessels.

12. A deposition system comprising:

a reactor;

a plurality of reactant supplies to said reactor, each reactant supply including a supply vessel and a reactant carrier gas path through said supply vessel to said reactor; each reactant supply being bypassed by a bypass path for flowing carrier gas in a bypass past the supply vessel;

a secondary supply line connected via an actuated switching valve to reactant gas and inert gas supplies;

a controller configured to control the carrier gas path and the bypass path to maintain a desired pressure in both the reactor and the supply vessel and to control flow of carrier and reactant into the reactor,

wherein, for each respective supply vessel, the bypass is performed by operating at least an upstream precursor supply valve and a downstream precursor supply valve connected to said respective supply vessel in tandem, the upstream precursor supply valve being disposed upstream of the respective supply vessel and the downstream precursor supply valve being disposed downstream of the respective supply vessel, wherein the reactant carrier gas path of the respective reactant supply vessel is defined through an associated bypass valve connected between the upstream and downstream precursor supply valves that control flow of carrier gas through the respective reactant supply vessel of the plurality of reactant supply vessels to establish the reactant carrier gas path of carrier gas through the upstream precursor supply valves, the respective reactant supply vessel, the downstream precursor supply valve and to the reactor, and the bypass path of carrier gas is defined through the associated bypass valve to the reactor chamber to bypass the respective reactant supply vessel; and

further comprising:

a first control software executable by the controller to control at least the upstream and downstream valves, the associated bypass valve, and the actuated switching valve in first predetermined sequence to conduct CVD (chemical vapor deposition), wherein the first predetermined sequence comprises opening and closing the upstream and downstream precursor supply valves, opening and closing the associated bypass valve, and opening and closing the actuated switching valve; and

a second control software executable by the controller to control at least the upstream and downstream valves, the associated bypass valve, and the actuated switching valve in a predetermined sequence comprises opening and closing the upstream and downstream precursor supply valves, opening and closing the associated bypass valve, and opening and closing the actuated switching valve.

13. The system according to claim 12 , further comprising:

a third control software executable by the controller to control the plurality of actuated valves and the actuated switching valve in a third sequence to sequentially conduct CVD and ALD deposition cycles.

14. The system according to claim 13 , wherein the first control software is executable by the controller to conduct the CVD cycle according to the first sequence by simultaneously flowing two reactants from a plurality of the reactant supplies to the reactor.

15. The system according to claim 13 , wherein the second control software is executable by the controller to conduct the ALD cycle according to the second sequence by sequentially flowing two reactants from a plurality of the reactant supplies to the reactor with an intervening purge cycle between the sequentially flowing.

16. The system of claim 13 , wherein the reactant gas supply comprises an oxidizer supply.

Assignments (2)
CONFIRMATORY LICENSE Recorded Mar 11, 2019
From: UNIVERSITY OF ILLINOIS, CHICAGO
To: NATIONAL SCIENCE FOUNDATION
Reel/Frame 048558/0807 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 27, 2015
From: TAKOUDIS, CHRISTOS G.; SINGH, MANISH; SELVARAJ, SATHEES KANNAN
To: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
Reel/Frame 035725/0088 →
Continuity (2)
Provisional Application 61891509 · Oct 16, 2013
Related Publication 20150104575A1 · Apr 16, 2015