Method of manufacturing a quantum dot optical component and backlight unit having the quantum dot optical component
A method of manufacturing a quantum dot optical component is provided. By the method, a plurality of quantum dot lines are formed on a first substrate, an encapsulation member that encapsulates the quantum dot lines is formed on the first substrate, a second substrate is laminated on the encapsulation member, and the first and second substrates are cut into a plurality of quantum dot optical components each including at least one of the quantum dot lines.
1. A method of manufacturing a quantum dot optical component comprising:
forming a plurality of parallel quantum dot lines on a first substrate, wherein the quantum dot lines are formed in a full-line shape or in a dashed-line shape;
forming an encapsulation member that encapsulates the quantum dot lines on the first substrate;
laminating a second substrate on the encapsulation member; and
cutting the first and second substrates in between each of the quantum dot lines into a plurality of quantum dot optical components each including at least one of the quantum dot lines.
2. The method of claim 1 , wherein the quantum dot lines are coated on a surface of the first substrate.
3. The method of claim 1 , wherein the quantum dot lines are filled in recess portions that are formed by etching a surface of the first substrate.
4. The method of claim 1 , wherein the quantum dot lines are a mixture of a quantum dot luminous-body and a resin.
5. The method of claim 1 , wherein the encapsulation member covers the quantum dot lines and an entire surface of the first substrate.
6. The method of claim 5 , wherein the encapsulation member is formed by laminating an organic layer and an inorganic layer.
7. The method of claim 1 , wherein the encapsulation member is a frit that encloses each of the quantum dot lines.
8. The method of claim 7 , wherein the frit includes a glass material that is cured by a laser exposure.
9. The method of claim 1 , further comprising: forming a reflective layer between the encapsulation member and the second substrate.
10. The method of claim 1 wherein the cutting comprises cutting the first and second substrates in a direction parallel with the quantum dot lines.