IP Library Granted Patent US 9,995,767
Granted Patent B2
US 9,995,767 · App. 14/515,421 · Granted Jun 12, 2018

Universal container for device under test

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Quick Facts
Patent No.
US 9,995,767
App. No.
14/515,421
Granted
Jun 12, 2018
Kind
B2
Abstract

In one embodiment, a universal test container can include a universal external electrical interface configured to couple to each of a plurality of different devices to test. In addition, the universal test container is configured to enclose each of the plurality of different devices to test.

Claims (38)

1. A universal test container comprising:

a universal external electrical interface that couples to each of a plurality of different devices to test;

a recessed area comprising said universal external electrical interface; and

an internal baffle for directing airflow within said universal test container;

said universal test container encloses each of said plurality of different devices to test.

2. The universal test container of claim 1 , further comprising:

an it inlet.

3. The universal test container of claim 1 , further comprising:

an air outlet.

4. The universal test container of claim 1 , further comprising:

a temperature sensor.

5. The universal test container of claim 1 , further comprising:

an identification tag.

6. The universal test container of claim 1 , wherein said plurality of different devices to test comprises a semiconductor chip.

7. The universal test container of claim 1 , wherein said plurality of different devices to test comprises a solid state drive.

8. The universal test container of claim 1 , wherein said plurality of different devices to test comprises a hard disk drive.

9. A universal test container comprising:

a base;

a lid that couples with said base;

a universal external electrical interface;

a recessed area comprising said universal external electrical interface; and

an internal baffle;

said universal test container encloses each of a plurality of different devices to test, said universal external electrical interface couples to each of said plurality of different devices to test, said internal baffle for directing airflow within said universal test container.

10. The universal test container of claim 9 , wherein said lid comprises an identification tag.

11. The universal test container of claim 9 , wherein said base comprises an identification tag.

12. The universal test container of claim 9 , further comprising a changeable baffle located within said universal test container.

13. The universal test container of claim 9 , further comprising:

an air inlet and an air outlet.

14. The universal test container of claim 9 , wherein said plurality of different devices to test comprises a semiconductor chip.

15. The universal test container of claim 9 , wherein said plurality of different devices to test comprises a printed circuit board.

16. A method comprising:

determining dimensions of a universal test container based on largest device to test of a plurality of different devices to test;

determining what type of testing to perform on said plurality of different devices; and

fabricating said universal test container based on the determined dimensions and the determined type of testing to perform, said universal test container encloses each of said plurality of different devices to test, said universal test container comprises a universal external electrical interface that couples to each of said plurality of different devices to test, said universal test container comprises a recessed area comprising said universal external electrical interface, said universal test container comprises an internal baffle for directing airflow within said universal test container.

17. The method of claim 16 , wherein said fabricating comprises a plastic.

18. The method of claim 16 , wherein said universal test container comprises an air inlet and an air outlet.

19. The method of claim 16 , wherein said universal test container comprises a base and a lid.

20. The method of claim 16 , wherein said plurality of different devices to test comprises a semiconductor chip.

Assignments (2)
CHANGE OF ADDRESS Recorded Dec 18, 2018
From: ADVANTEST CORPORATION
To: ADVANTEST CORPORATION
Reel/Frame 047987/0626 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 15, 2014
From: ROGEL-FAVILA, BEN; WOLFF, ROLAND; KUSHNICK, ERIC; FISHMAN, JAMES
To: ADVANTEST CORPORATION
Reel/Frame 033957/0842 →