IP Library Granted Patent US 9,356,111
Granted Patent B2
US 9,356,111 · App. 14/518,603 · Granted May 31, 2016

Nonvolatile semiconductor memory device and method of manufacturing the same

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,356,111
App. No.
14/518,603
Granted
May 31, 2016
Kind
B2
Abstract

A nonvolatile semiconductor memory device of an embodiment includes: a semiconductor layer; a tunnel insulating film that is formed on the semiconductor layer and includes a first organic molecular film including first organic molecules each having an alkyl molecular chain as the main chain; a charge storage layer formed on the tunnel insulating film, the charge storage layer being made of an inorganic material; a block insulating film formed on the charge storage layer; and a control gate electrode formed on the block insulating film.

Claims (14)

1. A memory device comprising:

a stacked body having insulating layers and control gate electrode layers alternately stacked;

a semiconductor layer provided on the stacked body, the semiconductor layer extending from the lowermost one of the control gate electrode layers to the uppermost one of the control gate electrode layers;

a first insulating film provided between the semiconductor layer and one of the control gate electrode layers;

a charge storage layer provided between the semiconductor layer and the first insulating film; and

a second insulating film provided between the semiconductor layer and the charge storage layer, the second insulating film including an alkyl molecular chain.

2. The device according to claim 1 , wherein the first insulating film is a block insulating film.

3. The device according to claim 1 , wherein the second insulating film is a tunnel insulating film.

4. The device according to claim 1 , wherein the second insulating film is an organic molecular film.

5. The device according to claim 1 , wherein a carbon number in the alkyl molecular chain is 8 to 30.

6. The device according to claim 1 , wherein the first insulating film has a stack structure formed with an oxide film formed on the semiconductor layer and an organic molecular film.

7. The device according to claim 1 , wherein the first insulating film includes an alkyl molecular chain.

8. The device according to claim 1 , wherein the alkyl molecular chain is one of an alkyl chain, an isoalkyl chain, and an alkyl halide chain.

9. The device according to claim 4 , wherein a film thickness of the organic molecular film is greater than or equal to 0.8 nm and less than or equal to 3.5 nm.

Assignments (4)
CHANGE OF NAME AND ADDRESS Recorded Jul 29, 2021
From: K.K PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 057016/0551 →
MERGER Recorded Jul 29, 2021
From: TOSHIBA MEMORY CORPORATION
To: K.K PANGEA
Reel/Frame 057016/0586 →
CHANGE OF NAME AND ADDRESS Recorded Jul 29, 2021
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 057016/0611 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 24, 2017
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 043709/0035 →