Cooling systems and methods using two cooling circuits
The cooling systems and methods of the present disclosure relate to cooling electronic equipment in data centers or any other applications that have high heat rejection temperature and high sensible heat ratio.
1. A cooling system comprising:
a first evaporator coil in thermal communication with an air intake flow from a heat load;
a first liquid refrigerant distribution unit coupled to the first evaporator coil to form a first fluid circuit;
a second evaporator coil disposed in series with the first evaporator coil and in thermal communication with an air output flow to the heat load;
a second liquid refrigerant distribution unit coupled to the second evaporator coil to form a second fluid circuit;
a water circuit in thermal communication with the first fluid circuit through a first condenser; and
a first compressor circuit in thermal communication with the second fluid circuit through a second condenser and in thermal communication with the water circuit through a third condenser,
wherein the water circuit has a closed loop in which water flows through the first condenser and the third condenser, and
wherein the first compressor circuit has a closed loop in which refrigerant flows through the second condenser and the third condenser.
2. The cooling system according to claim 1 , wherein the first evaporator coil is a primary evaporator coil and the second evaporator coil is a secondary evaporator coil.
3. The cooling system according to claim 1 , further comprising a second compressor circuit in thermal communication with the first fluid circuit.
4. The cooling system according to claim 3 , wherein the first fluid circuit is in thermal communication with the second compressor circuit through a refrigerant-to-refrigerant heat exchanger.
5. The cooling system according to claim 3 , wherein the first fluid circuit includes the first condenser in thermal communication with the water circuit, and
wherein the second compressor circuit includes the second condenser in thermal communication with the water circuit.
6. The cooling system according to claim 1 , wherein the first fluid circuit, the second fluid circuit, and the first compressor circuit are configured to circulate refrigerants.
7. A cooling system comprising: a first evaporator coil in thermal communication with an air intake flow to a heat load; a first liquid refrigerant distribution unit coupled to the first evaporator coil to form a first fluid circuit; a second evaporator coil disposed in series with the first evaporator coil in the air intake flow to the heat load and in thermal communication with the air intake flow to the heat load; a second liquid refrigerant distribution unit coupled to the second evaporator coil to form a second fluid circuit; a first cooling circuit in thermal communication with the first fluid circuit through a first condenser; and a second cooling circuit in thermal communication with the second fluid circuit through a second condenser and in thermal communication with the first cooling circuit through a third condenser, wherein the first cooling circuit has a closed loop in which water flows through the first condenser and the third condenser, and wherein the second cooling circuit has a closed loop in which refrigerant flows through the second condenser and the third condenser.
8. The cooling system according to claim 7 , wherein the first evaporator coil is a primary evaporator coil and the second evaporator coil is a secondary evaporator coil.
9. The cooling system according to claim 7 , further comprising a compressor circuit in thermal communication with the first fluid circuit.
10. The cooling system according to claim 9 , wherein the first fluid circuit, the second fluid circuit, and the compressor circuit are configured to circulate refrigerants.