Adhesive film and sealing product for organic electronic device using same
Provided are an adhesive film, and an organic electronic device (OED) encapsulation product using the same. Dimensional stability, lifespan, and durability may be enhanced even when a panel of an organic electronic device is large-sized and formed as a thin film by controlling dimensional tolerance and edge angular tolerance of the adhesive film, thereby ensuring long-term reliability, and process yields may be enhanced when the adhesive film is applied to an automation process.
1. A method of encapsulating an organic electronic device OED, the method comprising:
providing an adhesive film which comprises a curable adhesive layer comprising a curable resin,
controlling a dimensional tolerance (d) and edge angular tolerance (x) of the adhesive film to satisfy Equations 1 and 2 by storing the adhesive film at −10° C. to 10° C.;
applying the adhesive film, after controlling a dimensional tolerance (d) and edge angular tolerance (x) to satisfy Equations 1 and 2, to a substrate on which the organic electronic device OED is formed to cover an entire surface of the organic electronic device OED; and
curing the applied adhesive film:
d=|d f −d i |<800 μm [Equation 1]
x=|x f −x i |<0.05 degrees [Equation 2]
wherein d i is a length of a longer side or shorter side of the adhesive film at an optional i point before storing at −10° C. to 10° C., d f is a length of a longer side or shorter side of the adhesive film at a point of 2 weeks or more after the optional i point after storing at −10° C. to 10° C., x i is an angle of an edge of the adhesive film at an optional i point before storing at −10° C. to 10° C., and x f is an angle of an edge of the adhesive film at a point of 2 weeks or more after the optional i point after storing at −10° C. to 10° C.
2. The method according to claim 1 , wherein the curable adhesive layer has a viscosity at room temperature of 10 6 dyne/cm 2 or more.
3. The method according to claim 1 , wherein the curable resin has a water vapor transmission rate (WVTR) in a cured state of 50 g/m 2 ·day or less.
4. The method according to claim 1 , wherein the curable resin is a heat-curable resin, a photocurable resin, or a dual-curable resin.
5. The method according to claim 1 , wherein the curable resin comprises at least one curable functional group selected from the group consisting of a glycidyl group, an isocyanate group, a hydroxyl group, a carboxyl group, an amide group, an epoxide group, a cyclic ether group, a sulfide group, an acetal group, and a lactone group.
6. The method according to claim 1 , wherein the curable resin is an epoxy resin comprising a cyclic structure in a molecular structure.
7. The method according to claim 1 , wherein the curable resin is a silane-modified epoxy resin.
8. The method according to claim 1 , wherein the adhesive layer further comprises a moisture absorbent.
9. The method according to claim 8 , wherein the moisture absorbent is alumina, a metal oxide, a metal salt, or phosphorus pentoxide.
10. The method according to claim 8 , wherein the moisture absorbent is at least one selected from the group consisting of P 2 O 5 , Li 2 O, Na 2 O, BaO, CaO, MgO, Li 2 SO 4 , Na 2 SO 4 , CaSO 4 , MgSO 4 , CoSO 4 , Ga 2 (SO 4 ) 3 , Ti(SO 4 ) 2 , NiSO 4 , CaCl 2 , MgCl 2 , SrCl 2 , YCl 3 , CuCl 2 , CsF, TaF 5 , NbF 5 , LiBr, CaBr 2 , CeBr 3 , SeBr 4 , VBr 3 , MgBr 2 , BaI 2 , MgI 2 , Ba(ClO 4 ) 2 , and Mg(ClO 4 ) 2 .
11. The method according to claim 8 , wherein the adhesive layer comprises the moisture absorbent in an amount of 1 to 100 parts by weight relative to 100 parts by weight of the curable resin.
12. The method according to claim 1 , wherein the adhesive layer further comprises a filler.
13. The method according to claim 12 , wherein the filler is at least one selected from the group consisting of clay, talc, silica, zeolite, zirconia, titania, and montmorillonite.
14. The method according to claim 12 , wherein the adhesive layer comprises the filler in an amount of 1 to 50 parts by weight relative to 100 parts by weight of the curable resin.
15. The method according to claim 1 , wherein the adhesive layer further comprises a curing agent.
16. The method according to claim 15 , wherein the curing agent is an amine-based compound, imidazole-based compound, phenol-based compound, phosphorus-based compound, or acid anhydride-based compound.
17. The method according to claim 15 , wherein the adhesive layer comprises the curing agent in an amount of 1 to 10 parts by weight relative to 100 parts by weight of the curable resin.
18. The method according to claim 1 , wherein the adhesive layer further comprises an initiator.
19. The method according to claim 1 , wherein the adhesive layer further comprises a high molecular weight resin.