Semiconductor device
The present disclosure provides a semiconductor device, which includes a compensation area which includes p-regions and n-regions, and a plurality of transistor cells on the compensation area. Each of the plurality of transistor cells includes a source region, a body region, a gate and an interlayer dielectric, and a source metallization layer arranged on the interlayer dielectric. The semiconductor device further includes an additional n-doping region that is provided on top of the n-regions between two neighboring body regions, and a source plug which fills a contact hole formed through the interlayer dielectric between the source and body region and the source metallization layer, so as to electrically connect the source and body region and the source metallization layer.
1. A semiconductor device, comprising:
a compensation area which comprises p-regions and n-regions;
a plurality of transistor cells on the compensation area, each of the plurality of transistor cells comprising a source region, a body region, a gate and an interlayer dielectric;
a source metallization layer arranged on the interlayer dielectric;
an additional n-doping region that is provided on top of the n-regions between two neighboring body regions; and
a source plug which fills a contact hole formed through the interlayer dielectric between the source and body region and the source metallization layer, so as to electrically connect the source and body region and the source metallization layer,
wherein the semiconductor device further comprise one or more continuous gate fingers which interrupt the source metallization layer so as to insulate the source metallization layer and the gates of the transistor cells, the continuous gate fingers being oriented perpendicular to the gates.
2. The semiconductor device according to claim 1 , wherein the doping concentration of the additional n-doping region is 0.5×10 16 cm −3 ˜5×10 16 cm −3 .
3. The semiconductor device according to claim 1 , wherein the gate is formed of poly-silicon stripe.
4. The semiconductor device according to claim 3 , wherein the semiconductor device further comprises one or more gate fingers which are oriented perpendicular to the gates, each of the gate fingers electrically connecting two neighboring gates.
5. The semiconductor device according to claim 4 , wherein each of the gate fingers is formed of a continuous stripe.
6. The semiconductor device according to claim 4 , wherein each of the gate fingers is formed of a non-continuous stripe.
7. The semiconductor device according to claim 5 , wherein the gate finger is formed of metal or poly-silicon.
8. The semiconductor device according to claim 3 , wherein the width of the stripe of the gate is equal to or narrower than 8 μm.
9. The semiconductor device according to claim 4 , wherein the semiconductor device further comprises a surrounding gate ring, and the one or more gate fingers are connected to the surrounding gate ring.
10. The semiconductor device according to claim 4 , wherein the width of the gate finger is 10-50 μm.
11. The semiconductor device according to claim 1 , wherein the gates have a planar structure.
12. The semiconductor device according to claim 1 , wherein the semiconductor device is a super-junction device.
13. A semiconductor device, comprising:
a compensation area which comprises p-regions and n-regions;
a plurality of transistor cells on the compensation area, each of the plurality of transistor cells comprising a source region, a body region, a gate and an interlayer dielectric;
a source metallization layer arranged on the interlayer dielectric;
an additional n-doping region that is provided on top of the n-regions between two neighboring body regions; and
a source plug which fills a contact hole formed through the interlayer dielectric between the source and body region and the source metallization layer, so as to electrically connect the source and body region and the source metallization layer,
wherein the semiconductor device further comprises one or more intermitting gate fingers which interrupt the source metallization layer so as to insulate the source metallization layer and the gates of the transistor cells, the intermitting gate fingers being oriented perpendicular to the gates.
14. The semiconductor device according to claim 13 , wherein the intermitting gate finger is formed of poly-silicon and metal.