Semiconductor device and manufacturing method thereof
A semiconductor device includes a gate structure on a substrate; a raised source/drain region adjacent to the gate structure; and an interconnect plug on the doped region. The raised source/drain region includes a top surface being elevated from a surface of the substrate; and a doped region exposed on the top surface. The doped region includes a dopant concentration greater than any other portions of the raised source/drain region. A bottommost portion of the interconnect plug includes a width approximate to a width of the doped region.
1. A semiconductor device, comprising:
a gate structure on a substrate;
a raised source/drain region adjacent to the gate structure, wherein the raised source/drain region comprises:
a top surface being elevated from a surface of the substrate; and
a doped region within the raised source/drain region and substantially coplanar with the top surface, wherein the doped region comprises a dopant concentration greater than any other portions of the raised source/drain region; and
an interconnect plug on the doped region, wherein a bottommost portion of the interconnect plug comprises a width less than a width of the doped region.
2. The semiconductor device of claim 1 , wherein the interconnect plug comprises a silicide layer contacting the top surface, and a contacting area is smaller than the top surface.
3. The semiconductor device of claim 1 , wherein the doped region comprises a surface area exposed on the top surface smaller than the top surface.
4. The semiconductor device of claim 1 , wherein the width of the doped region is about 0.1 nm to 20 nm greater than the width of the bottommost portion.
5. The semiconductor device of claim 1 , wherein the doped region comprises a thickness in a range from about 5 nm to 20 nm.
6. The semiconductor device of claim 1 , wherein the raised source/drain region further comprises:
a first silicon germanium layer at a bottom of the raised source/drain region;
a second silicon germanium layer on the first silicon germanium layer, wherein the second silicon germanium layer comprises a germanium concentration that is greater than that of the first silicon germanium layer; and
a third silicon germanium layer on the second silicon germanium layer, wherein the third silicon germanium layer comprises a germanium concentration that is greater than that of the second silicon germanium layer.
7. The semiconductor device of claim 6 , wherein the doped region is encompassed by the third silicon germanium layer.
8. The semiconductor device of claim 6 , wherein the doped region comprises a thickness in a range from about 20% to 80% of a thickness of the third silicon germanium layer.
9. A semiconductor device, comprising:
a gate structure located on a substrate;
a crystallized raised source/drain region disposed adjacent to the gate structure, wherein the crystallized raised source/drain region comprises:
a top surface above a surface of the substrate; and
an amorphized doped region within the raised source/drain region and substantially coplanar with the top surface, wherein the amorphized doped region comprises a dopant concentration higher than any other portions of the crystallized raised source/drain region; and
an interconnect plug on the amorphized doped region, wherein a contacting area between the interconnect plug and the amorphized doped region is smaller than the top surface.
10. The semiconductor device of claim 9 , wherein the interconnect plug further comprises a silicide layer at a bottommost portion and contacting the amorphized doped region.
11. The semiconductor device of claim 10 , wherein the silicide layer comprises a surface area approximate to a surface area of the amorphized doped region exposed on the top surface.
12. The semiconductor device of claim 10 , wherein the silicide layer is based on an upper portion of the amorphized doped region.
13. The semiconductor device of claim 9 , wherein the crystallized raised source/drain region comprises:
a first epitaxial-grown doped layer;
a second epitaxial-grown doped layer comprising a dopant concentration higher than that of the first epitaxial-grown doped layer; and
a third epitaxial-grown doped layer comprising a dopant concentration higher than that of the second epitaxial-grown doped layer.
14. The semiconductor device of claim 13 , wherein the dopant concentration of the amorphized doped region is about 1.5-10 times higher than the dopant concentration of the third epitaxial-grown doped layer.
15. The semiconductor device of claim 13 , wherein the amorphized doped region comprises a rectangular profile in the third epitaxial-grown doped layer.
16. The semiconductor device of claim 13 , wherein the amorphized doped region comprises a dopant material that is the same as those of the first, second and third epitaxial-grown doped layers.
17. A semiconductor device, comprising:
a gate structure on a substrate;
an epitaxial source/drain region adjacent to the gate structure, wherein the epitaxial source/drain region comprises:
a top surface being elevated from a surface of the substrate; and
a doped region within the raised source/drain region and substantially coplanar with the top surface, wherein the doped region comprises a dopant concentration greater than any other portions of the epitaxial source/drain region; and
an interconnect plug on the doped region, wherein the interconnect plug comprises a silicide region contacting the top surface.
18. The semiconductor device of claim 17 , wherein silicide region has a contacting area smaller than the top surface.
19. The semiconductor device of claim 17 , wherein the silicide region comprises a first surface area approximate to a second surface area exposed on the top surface, of the epitaxial source/drain region.
20. The semiconductor device of claim 17 , wherein the epitaxial source/drain region further comprises a tip formed under the gate structure.