IP Library Granted Patent US 9,673,286
Granted Patent B2
US 9,673,286 · App. 14/531,181 · Granted Jun 6, 2017

Group III-V transistor with semiconductor field plate

Inventor: Michael A. Briere (Scottsdale, AZ)
Assignee: Infineon Technologies Americas Corp.
H01L29/405H01L29/2003H01L29/7786H01L29/7787
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Quick Facts
Patent No.
US 9,673,286
App. No.
14/531,181
Granted
Jun 6, 2017
Kind
B2
Abstract

There are disclosed herein various implementations of a group III-V transistor with a semiconductor field plate. Such a group III-V transistor includes a group III-V heterostructure situated over a substrate and configured to produce a two-dimensional electron gas (2DEG). In addition, the group III-V transistor includes a source electrode, a drain electrode, and a gate situated over the group heterostructure. The group III-V transistor also includes an insulator layer over the group III-V heterostructure and situated between the gate and the drain electrode, and a semiconductor field plate situated between the gate and the drain electrode, over the insulator layer.

Claims (31)

1. A group III-V transistor comprising:

a group III-V heterostructure situated over a substrate and configured to produce a two-dimensional electron gas (2DEG);

a source electrode, a drain electrode, and a gate situated over said group III-V heterostructure;

an insulator layer over said group III-V heterostructure and situated between said gate and said drain electrode,

wherein a gate-facing end of said insulator layer is in contact with, and terminates at, a side surface of said gate,

wherein a drain electrode-facing end of said insulator layer is in contact with a side surface, and a portion of an upper surface, of said drain electrode;

a semiconductor field plate situated between said gate and said drain electrode, over said insulator layer,

wherein a gate-facing end of said semiconductor field plate is in contact with said side surface, and a portion of an upper surface, of said gate,

wherein a drain electrode-facing end of said semiconductor field plate is in contact with a portion of the upper surface of said drain electrode;

wherein said semiconductor field plate adjoins said drain electrode.

2. The group III-V transistor of claim 1 , wherein said semiconductor field plate has a sheet resistance in a range from approximately 10 4 ohms/square to approximately 10 7 ohms/square.

3. The group III-V transistor of claim 1 , wherein said semiconductor field plate comprises an amorphous semiconductor layer.

4. The group III-V transistor of claim 1 , wherein said semiconductor field plate comprises a single crystalline semiconductor layer.

5. The group III-V transistor of claim 1 , wherein said semiconductor field plate comprises a polycrystalline semiconductor layer.

6. The group III-V transistor of claim 1 , wherein said semiconductor field plate comprises a polycrystalline III-Nitride layer.

7. The group III-V transistor of claim 1 , wherein said semiconductor field plate comprises an amorphous III-Nitride layer.

8. A III-Nitride transistor comprising:

a gallium nitride (GaN) channel layer situated over a substrate;

an aluminum gallium nitride (AlGaN) barrier layer situated over said GaN channel layer, said AlGaN barrier layer and said GaN channel layer configured to produce a two-dimensional electron gas (2DEG);

a source electrode, a drain electrode, and a gate situated over said AlGaN barrier layer;

an insulator layer over said AlGaN barrier layer and situated between said gate and said drain electrode,

wherein a gate-facing end of said insulator layer is in contact with, and terminates at, a side surface of said gate,

wherein a drain electrode-facing end of said insulator layer is in contact with a side surface, and a portion of an upper surface, of said drain electrode;

a semiconductor field plate situated between said gate and said drain electrode, over said insulator layer,

wherein a gate-facing end of said semiconductor field plate is in contact with said side surface, and a portion of an upper surface, of said gate,

wherein a drain electrode-facing end of said semiconductor field plate is in contact with a portion of the upper surface of said drain electrode;

wherein said semiconductor field plate adjoins said drain electrode.

9. The III-Nitride transistor of claim 8 , wherein said semiconductor field plate has a sheet resistance in a range from approximately 10 4 ohms/square to approximately 10 7 ohms/square.

10. The Ill-Nitride transistor of claim 8 , wherein said semiconductor field plate comprises an amorphous semiconductor layer.

11. The III-Nitride transistor of claim 8 , wherein said semiconductor field plate comprises a single crystalline III-Nitride layer.

12. The III-Nitride transistor of claim 8 , wherein said semiconductor field plate comprises a polycrystalline III-Nitride layer.

Assignments (2)
MERGER AND CHANGE OF NAME Recorded Apr 13, 2016
From: INFINEON TECHNOLOGIES NORTH AMERICA CORP.; INTERNATIONAL RECTIFIER CORPORATION; INTERNATIONAL RECTIFIER CORPORATION
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 038463/0859 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 3, 2014
From: BRIERE, MICHAEL A.
To: INTERNATIONAL RECTIFIER CORPORATION
Reel/Frame 034092/0011 →
Continuity (2)
Provisional Application 61910522 · Dec 2, 2013
Related Publication 20150155358A1 · Jun 4, 2015