Method for graded anti-reflective coatings by physical vapor deposition
A method for forming an anti-reflective coating (ARC) includes positioning a substrate below a target and flowing a first gas to deposit a first portion of the graded ARC onto the substrate. The method includes gradually flowing a second gas to deposit a second portion of the graded ARC, and gradually flowing a third gas while simultaneously gradually decreasing the flow of the second gas to deposit a third portion of the graded ARC. The method also includes flowing the third gas after stopping the flow of the second gas to form a fourth portion of the graded ARC. In another embodiment a film stack having a substrate having a graded ARC disposed thereon is provided. The graded ARC includes a first portion, a second portion disposed on the first portion, a third portion disposed on the second portion, and a fourth portion disposed on the third portion.
1. A method for forming a graded anti-reflective coating in a physical vapor deposition processing chamber comprising:
positioning a substrate on a substrate support in the processing chamber below a target;
flowing a first inert gas into the processing chamber to sputter the target to deposit a first portion of the graded anti-reflective coating onto the substrate, the first portion having a first refractive index;
gradually flowing a second gas into the processing chamber to deposit a second portion of the graded anti-reflective coating onto the substrate, the second portion having a second refractive index that is less than the first refractive index;
gradually flowing a third gas into the processing chamber while simultaneously gradually decreasing the flow of the second gas into the processing chamber to deposit a third portion of the graded anti-reflective coating onto the substrate, the third portion having a third refractive index that is less than the second refractive index;
arriving at a final value of a flow rate of the third gas to tune a stress level of the graded anti-reflective coating; and
flowing the third gas into the processing chamber after stopping the flow of the second gas to form a fourth portion of the graded anti-reflective coating, the fourth portion having a fourth refractive index that is less than the third refractive index.
2. The method of claim 1 , wherein the first gas is argon gas flowed at about 30 sccm.
3. The method of claim 1 , wherein the second gas and third gas are selected from a group comprising nitrogen gas (N 2 ), nitrogen dioxide (NO 2 ), fluorine gas (F 2 ), oxygen gas (O 2 ), hydrogen gas (H2), H 2 O in vapor form, methane (CH4), carbon monoxide (CO), methane (CH 4 ), and carbon dioxide (CO 2 ).
4. The method of claim 3 , wherein the second gas is nitrogen gas, the third gas is oxygen gas and that target comprises silicon.
5. The method of claim 4 , wherein the first portion comprises silicon.
6. The method of claim 5 , wherein the nitrogen gas is gradually flowed at about 100 sccm and the second portion comprises silicon and nitrogen.
7. The method of claim 6 , wherein the oxygen gas is gradually flowed at between about 0 sccm to about 100 sccm, and the third portion comprises silicon, nitrogen and oxygen.
8. The method of claim 7 , wherein the nitrogen gas is gradually flowed while the oxygen gas is gradually flowed.
9. The method of claim 7 , wherein the nitrogen gas is gradually extinguished while the oxygen gas is gradually flowed.
10. The method of claim 9 , wherein the fourth portion comprises silicon and oxygen.
11. A method for forming a graded anti-reflective coating comprising:
positioning a substrate on a substrate support in a physical vapor deposition chamber below a silicon target;
sputtering the silicon target with argon gas to deposit a first portion of the graded anti-reflective coating onto the substrate, the first portion having a first refractive index;
gradually flowing nitrogen gas into the processing chamber to deposit a second portion of the graded anti-reflective coating onto the substrate, the second portion having a second refractive index that is less than the first refractive index;
gradually flowing oxygen gas into the processing chamber while simultaneously gradually decreasing the flow of the nitrogen gas into the processing chamber to deposit a third portion of the graded anti-reflective coating onto the substrate, the third portion having a third refractive index that is less than the second refractive index;
arriving at a final value of a flow rate of the oxygen gas to tune a stress level of the graded anti-reflective coating; and
flowing the oxygen gas into the processing chamber after stopping the flow of the nitrogen gas to form a fourth portion of the graded anti-reflective coating onto the substrate, the fourth portion having a fourth refractive index that is less than the third refractive index.
12. The method of claim 11 , wherein the physical vapor deposition chamber pressure is less than about 100 mTorr and at room temperature.
13. The method of claim 12 , wherein DC power in the physical vapor deposition chamber is less than about 20 kW and pulsed at a frequency of about 100 kHz and a duty cycle of about 97%.
14. The method of claim 13 , wherein the physical vapor deposition chamber pressure is about 10 mTorr and the DC power is about 6 kW.