Flexible middle layer for RFID patch on tires
A tire mountable apparatus and a method of fabricating a tire mountable apparatus is disclosed. The tire mountable apparatus includes a first layer, a second layer and a middle layer disposed between the first layer and the second layer. The tire mountable apparatus further includes an electrical device embedded in the middle layer of the tire mountable apparatus. The middle layer of the tire mountable apparatus completely surrounds the electrical device and is formed from a potting compound, The potting compound does not require exposure to heat, air, moisture, or light to clue and does not require solvent evaporation or outgassing of reaction products to cure. The tire mountable apparatus may be constructed by curing the potting compound between the first layer and the second layer.
1. A method of constructing a tire mountable apparatus, comprising:
mixing a potting compound;
placing said potting compound on a first layer of uncured material to form a middle layer, said first layer comprising a rubber material;
coating an electrical device in said potting compound;
placing said electrical device in said middle layer such that said electrical device is completely surrounded by said middle layer;
placing a second layer of uncured material on top of said middle layer, said second layer comprising said rubber material; and
curing said middle layer between said first layer and said second layer to form said tire mountable apparatus, said first and second layers and said middle layer all having a substantially equal cured hardness;
wherein said potting compound does not require exposure to heat, air, moisture, or light to cure and does not require solvent evaporation or outgassing of reaction products to cure.
2. The method of claim 1 , wherein said electrical device comprises an RFID tag.
3. The method of claim 1 , wherein said step of coating said electrical device in said potting compound comprises dipping said electrical device in said potting compound.
4. The method of claim 1 , wherein said step of coating said electrical device in said potting compound comprises moving said electrical device in said potting compound placed on said first layer of uncured material.
5. The method of claim 1 , wherein said potting compound has a viscosity in the range of about 800 mPa·s to about 1400 mPa·s at about 25° C. when said potting compound is in an uncured state, and said potting compound has a hardness in the range of about 10 to about 70 Shore A when said potting compound is in a cured state.
6. The method of claim 1 , wherein said method comprises sealing said middle layer in a pocket defined by said first layer and said second layer.
7. The method of claim 1 , wherein said method further comprises bonding said tire mountable apparatus to a tire structure.
8. A method of constructing a tire mountable apparatus, comprising:
mixing a potting compound;
placing said potting compound on a first layer of uncured material to form a middle layer, said first layer comprising a rubber material having a cured hardness in the range of about 25 to about 85 Shore A;
coating an electrical device in said potting compound;
placing said electrical device in said middle layer such that said electrical device is completely surrounded by said middle layer;
placing a second layer of uncured material on top of said middle layer, said second layer comprising a rubber material having a cured hardness that is less than or greater than the cured hardness of said first layer; and
curing said middle layer between said first layer and said second layer to form said tire mountable apparatus, said middle layer having a cured hardness that is in the range between the cured hardness of the first layer and the cured hardness of the second layer;
wherein said potting compound does not require exposure to heat, air, moisture, or light to cure and does not require solvent evaporation or outgassing of reaction products to cure.
9. The method of claim 8 , wherein said electrical device comprises an RFID tag.
10. The method of claim 8 , wherein said step of coating said electrical device in said potting compound comprises dipping said electrical device in said potting compound.
11. The method of claim 8 , wherein said step of coating said electrical device in said potting compound comprises moving said electrical device in said potting compound placed on said first layer of uncured material.
12. The method of claim 8 , wherein said potting compound has a viscosity in the range of about 800 mPa·s to about 1400 mPa·s at about 25° C. when said potting compound is in an uncured state, and said potting compound has a hardness in the range of about 10 to about 70 Shore A when said potting compound is in a cured state.
13. The method of claim 8 , wherein said method comprises sealing said middle layer in a pocket defined by said first layer and said second layer.
14. The method of claim 8 , wherein said method further comprises bonding said tire mountable apparatus to a tire structure.