Peeling apparatus and manufacturing apparatus of semiconductor device
To eliminate electric discharge when an element formation layer including a semiconductor element is peeled from a substrate used for manufacturing the semiconductor element, a substrate over which an element formation layer and a peeling layer are formed and a film are made to go through a gap between pressurization rollers. The film is attached to the element formation layer between the pressurization rollers, bent along a curved surface of the pressurization roller on a side of the pressurization rollers, and collected. Peeling is generated between the element formation layer and the peeling layer and the element formation layer is transferred to the film. Liquid is sequentially supplied by a nozzle to a gap between the element formation layer and the peeling layer, which is generated by peeling, so that electric charge generated on surfaces of the element formation layer and the peeling layer is diffused by the liquid.
1. A method for manufacturing a display module, comprising:
forming a release layer over a substrate;
forming an element layer over the release layer;
removing part of the element layer by irradiating the part with laser, whereby peeling is caused at an interface between the release layer and the element layer;
attaching a film over the element layer by a roller;
supplying liquid to a portion where the peeling is caused; and
separating the element layer from the substrate, wherein the separated interface is supplied with the liquid as the separation proceeds.
2. The method according to claim 1 , wherein the liquid is water.
3. The method according to claim 1 , wherein the film is attached over the element layer after the peeling is caused.
4. The method according to claim 1 , further comprising: oxidizing a surface of the release layer.
5. The method according to claim 1 , wherein the release layer includes a metal film comprising a metal selected from tungsten, molybdenum, titanium, tantalum, niobium, nickel, cobalt, zirconium, zinc, ruthenium, rhodium, palladium, osmium, and iridium, or an alloy thereof.
6. The method according to claim 1 , wherein the display module is an EL module.
7. A method for manufacturing a display module, comprising:
forming a release layer over a substrate;
forming an element layer over the release layer;
removing part of the element layer, whereby peeling is caused at an interface between the release layer and the element layer;
attaching a film over the element layer by a roller;
supplying liquid to a portion where the peeling is caused;
separating the element layer from the substrate, wherein the separated interface is supplied with the liquid as the separation proceeds; and
blowing dry air at the separated element layer.
8. The method according to claim 7 , wherein the part of the element layer is removed by laser irradiation.
9. The method according to claim 7 , wherein the liquid is water.
10. The method according to claim 7 , wherein the film is attached over the element layer after the peeling is caused.
11. The method according to claim 7 , further comprising: oxidizing a surface of the release layer.
12. The method according to claim 7 , wherein the release layer includes a metal film comprising a metal selected from tungsten, molybdenum, titanium, tantalum, niobium, nickel, cobalt, zirconium, zinc, ruthenium, rhodium, palladium, osmium, and iridium, or an alloy thereof.
13. The method according to claim 7 , wherein the display module is an EL module.
14. A method for manufacturing a display module, comprising:
forming a release layer over a substrate;
forming an element layer over the release layer;
removing part of the element layer, whereby peeling is caused at an interface between the release layer and the element layer;
attaching a film over the element layer;
supplying liquid to a portion where the peeling is caused;
separating the element layer from the substrate by a roller, wherein the separation proceeds as the roller rolls, and the separated interface is supplied with the liquid as the separation proceeds.
15. The method according to claim 14 , wherein the part of the element layer is removed by laser irradiation.
16. The method according to claim 14 , wherein the liquid is water.
17. The method according to claim 14 , wherein the film is attached over the element layer after the peeling is caused.
18. The method according to claim 14 , further comprising: oxidizing a surface of the release layer.
19. The method according to claim 14 , further comprising: blowing dry air at the separated element layer.
20. The method according to claim 14 , wherein the display module is an EL module.