Semiconductor device and structure
An Integrated Circuit device, including: a base wafer including single crystal, the base wafer including a plurality of first transistors; at least one metal layer providing interconnection between the plurality of first transistors; a second layer including a plurality of second transistors, the second layer overlying the at least one metal layer, where the plurality of second transistors include single crystal, and where the second layer includes a through layer via with a diameter of less than 250 nm; a plurality of conductive pads, where at least one of the conductive pads overlays at least one of the second transistors; and at least one I/O circuit, where the at least one I/O circuit is adapted to interface with external devices through at least one of the plurality of conductive pads, where the at least one I/O circuit includes at least one of the first transistors.
1. An Integrated Circuit device, comprising:
a base wafer comprising single crystal, said base wafer comprising a plurality of first transistors;
at least one metal layer providing interconnection between said plurality of first transistors;
a second layer of less than 2 micron thickness, said second layer comprising a plurality of second transistors, said second layer overlying said at least one metal layer,
wherein said second layer comprises a through layer via with a diameter of less than 150 nm; and
at least one conductive structure constructed to provide power to a portion of said second transistors,
wherein said provide power is controlled by at least one of said transistors.
2. An Integrated Circuit device according to claim 1 ,
wherein at least one of said second transistors comprises a back-bias structure.
3. An Integrated Circuit device according to claim 1 , further comprising:
at least one thermal conduction path from at least one of said second transistors to an external surface of said Integrated Circuit device.
4. An Integrated Circuit device according to claim 1 , further comprising:
a shielding layer,
wherein said shielding layer provides shielding for said at least one metal layer from heat resulting from optical annealing of said second transistors.
5. An Integrated Circuit device according to claim 1 ,
wherein said at least one conductive structure is disposed between said base wafer and said second layer.
6. An Integrated Circuit device according to claim 1 , further comprising:
a conductive pad overlying at least one of said second transistors.
7. An Integrated Circuit device according to claim 1 , further comprising:
at least one thermal conduction path from said at least one conductive structure to an external surface of said Integrated Circuit device.
8. An Integrated Circuit device, comprising:
a base wafer comprising single crystal, said base wafer comprising a plurality of first transistors;
at least one metal layer providing interconnection between said plurality of first transistors;
a second layer of less than 2 micron thickness, said second layer comprising a plurality of second transistors, said second layer overlying said at least one metal layer,
wherein said plurality of second transistors comprise single crystal, and
wherein said second layer comprises a through layer via with a diameter of less than 150 nm;
a plurality of conductive pads,
wherein at least one of said conductive pads overlays at least one of said second transistors; and
at least one I/O circuit,
wherein said at least one I/O circuit is adapted to interface with external devices through at least one of said plurality of conductive pads,
wherein said at least one I/O circuit comprises at least one of said first transistors.
9. An Integrated Circuit device according to claim 8 ,
wherein at least one of said second transistors comprise a back-bias structure.
10. An Integrated Circuit device according to claim 8 , further comprising:
at least one thermal conduction path from at least one of said second transistors to an external surface of said Integrated Circuit device.
11. An Integrated Circuit device according to claim 8 , further comprising:
a shielding layer,
wherein said shielding layer provides shielding for said at least one metal layer from heat resulting from optical annealing of said second transistors.
12. An Integrated Circuit device according to claim 8 , further comprising:
at least one heat spreader layer disposed underneath said second layer.
13. An Integrated Circuit device according to claim 8 , further comprising:
at least one conductive structure,
wherein said at least one conductive provides power to a portion of said second transistors, and
wherein said provide power is controlled by at least one of said transistors.
14. An Integrated Circuit device, comprising:
a base wafer comprising single crystal, said base wafer comprising a plurality of first transistors;
at least one metal layer providing interconnection between said plurality of first transistors;
a second layer comprising a plurality of second transistors, said second layer overlying said at least one metal layer,
wherein said plurality of second transistors comprise single crystal, and
wherein said second layer comprises a through layer via with a diameter of less than 250 nm;
a plurality of conductive pads,
wherein at least one of said conductive pads overlays at least one of said second transistors; and
at least one I/O circuit,
wherein said at least one I/O circuit is adapted to interface with external devices through at least one of said plurality of conductive pads,
wherein said at least one I/O circuit comprises at least one of said first transistors.
15. An Integrated Circuit device according to claim 14 ,
wherein at least one of said second transistors comprise a back-bias structure.
16. An Integrated Circuit device according to claim 14 , further comprising:
at least one thermal conduction path from at least one of said second transistors to an external surface of said Integrated Circuit device.
17. An Integrated Circuit device according to claim 14 , further comprising:
a shielding layer,
wherein said shielding layer provides shielding for said at least one metal layer from heat resulting from annealing of said second transistors.
18. An Integrated Circuit device according to claim 14 , further comprising:
at least one heat spreader layer disposed underneath said second layer.
19. An Integrated Circuit device according to claim 14 , further comprising:
at least one conductive structure,
wherein said at least one conductive provides power to a portion of said second transistors, and
wherein said provide power is controlled by at least one of said transistors.
20. An Integrated Circuit device according to claim 14 ,
wherein at least one of said second transistors comprises a back-bias structure, and
wherein said back-bias structure comprises a refractory metal.
21. An Integrated Circuit device according to claim 14 further comprising:
a conductive pad overlying at least one of said second transistors.