IP Library › Granted Patent US 9,277,650
Granted Patent B2
US 9,277,650 · App. 14/542,753 · Granted Mar 1, 2016

Combined wiring board and method for manufacturing the same

Inventors: Teruyuki Ishihara (Ogaki, JP); Michimasa Takahashi (Ogaki, JP)
Assignee: IBIDEN CO., LTD.
H05K1/142H05K1/0271H05K1/144H05K3/0097H05K3/368H05K1/0228H05K3/0052H05K2201/068H05K2201/2018H05K2201/2072H05K2203/0169Y10T29/49126
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Quick Facts
Patent No.
US 9,277,650
App. No.
14/542,753
Granted
Mar 1, 2016
Kind
B2
Abstract

A combined wiring board includes multiple wiring boards, and a connected metal frame having multiple metal frames and one or more connecting portions such that the metal frames are connected each other by the connecting portion or connecting portions and have accommodation opening portions formed to accommodate the wiring boards, respectively.

Claims (14)

1. a combined wiring board, comprising: a plurality of wiring boards; and a connected metal frame comprising a plurality of metal frames and at least one connecting portion such that the plurality of metal frames is connected each other by the connecting portion and has a plurality of accommodation opening portions configured to accommodate the wiring boards, respectively, wherein each of the metal frames has a coefficient of thermal expansion which is higher than a coefficient of thermal expansion of each of the wiring boards with respect to a direction of main surfaces of the metal frames and a direction of main surfaces of the wiring boards.

2. A combined wiring board according to claim 1 , wherein the connecting portion comprises an adhesive agent.

3. A combined wiring board according to claim 2 , wherein each of the metal frames has a plurality of crimped portions plastically deformed such that wall portions of each of the metal frames in the accommodation opening portions are in contact with side wall portions of the wiring boards to fix the wiring boards in the accommodation opening portions of the metal frames, respectively.

4. A combined wiring board according to claim 2 , wherein each of the metal frames has a plurality of slit portions formed in the accommodation opening portion, and each of the wiring boards has a plurality of support piece portions configured to engage with the plurality of slit portions, respectively.

5. A combined wiring board according to claim 1 , wherein each of the metal frames has a plurality of crimped portions plastically deformed such that wall portions of each of the metal frames in the accommodation opening portions are in contact with side wall portions of the wiring boards to fix the wiring boards in the accommodation opening portions of the metal frames, respectively.

6. A combined wiring board according to claim 5 , wherein each of the metal frames has a plurality of slit portions formed in the accommodation opening portion, and each of the wiring boards has a plurality of support piece portions configured to engage with the plurality of slit portions, respectively.

7. A combined wiring board according to claim 5 , wherein each of the metal frames has a plurality of slit portions formed in the accommodation opening portion, each of the wiring boards has a plurality of support piece portions configured to engage with the plurality of slit portions, respectively, and the plurality of crimped portions are formed adjacent to the plurality of slit portions.

8. A combined wiring board according to claim 5 , wherein each of the metal frames has a plurality of slit portions formed in the accommodation opening portion, and each of the wiring boards has a plurality of support piece portions configured to engage with the plurality of slit portions, respectively.

9. A combined wiring board according to claim 1 , wherein the plurality of metal frames has a plurality of coupling portions configured to engage each other such that the metal frames are connected each other.

10. A combined wiring board according to claim 1 , wherein each of the metal frames has a thickness which is less than a thickness of each of the wiring boards.

11. A combined wiring board according to claim 10 , wherein each of the metal frames has a plurality of crimped portions plastically deformed such that wall portions of each of the metal frames in the accommodation opening portions are in contact with side wall portions of the wiring boards to fix the wiring boards in the accommodation opening portions of the metal frames, respectively.

12. A combined wiring board according to claim 10 , wherein each of the metal frames has a plurality of slit portions formed in the accommodation portion, and each of the wiring boards has a plurality of support piece portions configured to engage with the plurality of slit portions, respectively.

13. A combined wiring board according to claim 1 , wherein the accommodation opening portion of each of the metal frames is configured such that a clearance is formed between the metal frame and the wiring board accommodated in the accommodation opening portion of the metal frame.

14. A combined wiring board according to claim 1 , wherein each of the metal frames has a plurality of alignment holes.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 10, 2015
From: ISHIHARA, TERUYUKI; TAKAHASHI, MICHIMASA
To: IBIDEN CO., LTD.
Reel/Frame 034930/0432 →
Priority Claims (1)
JP 2013-236517 · Nov 15, 2013 · national
Continuity (1)
Related Publication 20150136454A1 · May 21, 2015