Solid body joining of a carrier body and a cover layer, particularly by anodic bonding
In a method for solid body joining of a carrier body ( 10 ) and a cover layer ( 20 ), in particular by anodic bonding, the cover layer ( 20 ) is pressed with a pressing force against a curved carrier body surface ( 11 ), wherein the pressing force during the solid body joining is distributed by way of a pressure intermediary device ( 30 ) areally and simultaneously over the whole cover layer ( 20 ) and is directed perpendicularly to the curvature of the carrier body surface ( 11 ). A composite component comprising a carrier body ( 10 ) and a cover layer ( 20 ) is also disclosed, wherein a curved areal joining region ( 13 ) is formed between a cover layer surface ( 21 ) and a carrier body surface ( 11 ).
1. A method for anodic bonding of a carrier body and a cover layer,
the cover layer is pressed with a pressing force against a carrier body surface,
the carrier body surface has a curvature,
the cover layer is joined to the carrier body with anodic bonding,
the pressing force being created with a pressing piston during the anodic bonding is distributed by way of a pressure intermediary device areally and simultaneously over the whole cover layer and is directed perpendicularly to the curvature of the carrier body surface, and
the pressure intermediary device comprises a deformable layer of a particulate material which is arranged between the pressing piston and the cover layer and is pressed with the pressing piston against the cover layer.
2. The method according to claim 1 , wherein
the particulate material comprises ceramics spheres.
3. The method according to claim 1 , wherein
the pressing force is generated by way of an ambient pressure, and
the pressure intermediary device comprises a gaseous material on which the ambient pressure acts and which covers the cover layer.
4. The method according to claim 1 , wherein
the carrier body is made of a ceramics material, the carrier body surface of which contains silicon, and the cover layer is made of an Na-based glass.
5. The method according to claim 1 , comprising the step
heating the cover layer so that the cover layer is plastically deformable.
6. The method according to claim 1 , wherein
the carrier body surface has a spherical curvature.
7. The method according to claim 1 , comprising at least one of the steps
mechanically processing a free surface of the cover layer, and
solid body joining of the carrier body and a further cover layer, which is connected to a further carrier body surface of the carrier body.
8. The method according to claim 7 , wherein
the carrier body surface is provided with a spherical curvature, and
the free surface of the cover layer is manufactured with an aspherical curvature by way of mechanical processing.
9. The method according to claim 1 , comprising the step
surface treatment of the carrier body surface such that gaseous reaction products of the anodic bonding are absorbed at the carrier body surface or are conducted into a surroundings of the carrier body and the cover layer.
10. The method according to claim 9 , wherein the surface treatment of the carrier body surface comprises
roughening of the carrier body surface by etching, or
deposition of a gas absorption layer.
11. The method according to claim 10 , wherein the gas absorption layer is made of SiO2.