Light extraction element

1. A light emitting element comprising:

an emissive element comprising a host material and an emissive guest material, the emissive element substantially free of light scattering material; and

a light scattering element comprising either a non-emissive or an emissive material, wherein the light scattering element is between about 2.5% to about 60% by volume voids and the thickness ratio of light scattering element to the emissive element is less than about 1:2;

wherein the emissive element and the light scattering element have substantially the same refractive index, and the emissive and light scattering elements do not exhibit clear interface between them.

2. The light emitting converting element of claim 1 , wherein the emissive element and the light scattering element comprise substantially the same material.

3. The light emitting element of claim 1 , wherein the light scattering elements comprise materials substantially concurrently sintered in the same manner as the emissive element.

4. The light emitting element of claim 1 , wherein the host material is Y 3 Al 5 O 12 , Lu 3 Al 5 O 12 , Ca 3 Sc 2 Si 3 O 12 , (Y,Tb) 3 Al 5 O 12 , (Lu, Y, Gd) 3 (Al, Ga) 5 O 12 , Lu 2 CaSi 3 Mg 2 O 12 , or Lu 2 CaAl 4 SiO 12 .

5. The light emitting element of claim 1 , wherein the emissive guest material at least comprises Ce.

6. The light emitting element of claim 5 , further comprising an emissive guest material comprising Mn, Nd, Er, Eu, Cr, Yb, Sm, Tb, Gd, or Pr.

7. A semiconductor light emitting device comprising:

a light emitting source providing an emitted radiation; and

a light emitting element of claim 1 , wherein the light emitting element is positioned to receive the radiation emitted from the light emitting source.

8. A method of making the ceramic wavelength converting element of claim 1 , comprising the steps of

providing an emissive element substantially free of light scattering material;

providing a light scattering element defining 2.5 vol % to about 60 vol % voids therein, the light scattering element less than one-third as thick of the emissive element.

9. The method of claim 8 , wherein providing the light scattering element comprises forming a scattering element from a slurry comprising ceramic precursor materials and void creating materials, wherein the void creating material comprise about 2.5 vol % to about 60 vol % of the slurry.

10. The method of claim 8 , wherein the emissive element and the light scattering element are substantially concurrently sintered.

11. The method of claim 8 , wherein the host material is (Lu, Y, Gd) 3 (Al, Ga) 5 O 12 .

12. The method of claim 8 , wherein the emissive guest material is at least Ce.

13. The method of claim 12 , wherein the emissive guest material has a concentration of about 0.05 atomic % to about 10.0 atomic %.