Memories and methods of operating memories having memory cells sharing a resistance variable material

1. A memory, comprising:

a resistance variable material;

a first heater under a first memory cell area of the resistance variable material;

a second heater under a second memory cell area of the resistance variable material and spaced apart from the first heater by a first distance in a first direction;

a third heater under a third memory cell area of the resistance variable material and spaced apart from the second heater by a second distance in the first direction; and

a controller for controlling operations on the memory;

wherein the controller is configured to concurrently enable the first heater and the second heater for programming a memory cell of the first memory cell area and a memory cell of the second memory cell area;

wherein the resistance variable material is contiguous in the first direction from the first heater to the third heater; and

wherein the second distance is greater than the first distance.

2. The memory of claim 1 , further comprising:

a fourth heater under a fourth memory cell area of the resistance variable material and spaced apart from the third heater by the first distance in the first direction;

wherein the resistance variable material is contiguous in the first direction from the first heater to the fourth heater; and

wherein the controller is further configured to concurrently enable the third heater and the fourth heater for programming a memory cell of the third memory cell area and a memory cell of the fourth memory cell area.

3. The memory of claim 1 , further comprising:

wherein the first heater is separated from the second heater by a first dielectric material; and

wherein the third heater is separated from the second heater by a second dielectric material different from the first dielectric material.

4. The memory of claim 3 , further comprising:

wherein the third heater is further separated from the second heater by areas of the first dielectric material on opposing sides of the second dielectric material.

5. A method of operating a memory, comprising:

receiving a data word to be programmed to the memory;

remapping the data word into a plurality of bit pairs; and

arranging the bit pairs such that bit pairs whose bits are both to be programmed are programmed to respective pairs of memory cells of the memory sharing a resistance variable material and separated by a first distance;

wherein memory cells of the pairs of memory cells of the memory sharing the resistance variable material and separated by a first distance are separated from adjacent memory cells of the memory sharing the resistance variable material by a second distance greater than the first distance.

6. The method of claim 5 , further comprising:

programming the bit pairs, whose bits are both to be programmed, to their respective pairs of memory cells of the memory sharing a resistance variable material and separated by the first distance during a same program operation.

7. The method of claim 5 , wherein remapping the data word comprises moving a bit of the data word to a different location of the remapped data word.

8. The method of claim 7 , wherein moving a bit of the data word to a different location of the remapped data word comprises moving a bit of the data word that is to be programmed, and wherein the different location of the remapped data word corresponds to a location of the data word containing a bit of the data word that is not to be programmed.

9. The method of claim 5 , further comprising arranging the bit pairs such that all bit pairs whose bits are both to be programmed are programmed to respective pairs of memory cells of the memory sharing the resistance variable material and separated by the first distance.

10. The memory of claim 1 , wherein the first memory cell area is spaced apart from a fourth memory cell area in a second direction orthogonal to the first direction, wherein the second memory cell area is spaced apart from a fifth memory cell area in the second direction, and wherein the resistance variable material does not extend to the fourth memory cell area or to the fifth memory cell area.

11. The memory of claim 1 , wherein the resistance variable material is a first resistance variable material, the memory further comprising:

a second resistance variable material spaced apart from the first resistance variable material in a second direction orthogonal to the first direction;

a fourth heater under a fourth memory cell area of the second resistance variable material;

a fifth heater under a fifth memory cell area of the second resistance variable material and spaced apart from the fourth heater by the first distance in the first direction; and

a sixth heater under a sixth memory cell area of the second resistance variable material and spaced apart from the fifth heater by the second distance in the first direction;

wherein the controller is further configured to concurrently enable the fourth heater and the fifth heater for programming a memory cell of the fourth memory cell area and a memory cell of the fifth memory cell area; and

wherein the second resistance variable material is contiguous in the first direction from the fourth heater to the sixth heater.

12. The method of claim 6 , wherein programming the bit pairs, whose bits are both to be programmed, to their respective pairs of memory cells comprises changing a resistance of the resistance variable material for each memory cell of their respective pairs of memory cells.

13. A method of operating a memory, comprising:

receiving a data word to be programmed to the memory;

remapping the data word into a plurality of bit pairs;

arranging the bit pairs such that bit pairs whose bits are both to be programmed are programmed to respective pairs of memory cells of the memory sharing a resistance variable material and separated by a first distance in a first direction; and

programming a particular bit pair whose bits are both to be programmed to its respective pair of memory cells by enabling a respective heater for each memory cell of its respective pair of memory cells;

wherein memory cells of the pairs of memory cells of the memory sharing the resistance variable material and separated by the first distance in the first direction are separated from adjacent memory cells of the memory sharing the resistance variable material by a second distance greater than the first distance and in the first direction.

14. The method of claim 13 , wherein enabling the respective heater for each memory cell of its respective pair of memory cells comprises concurrently enabling the respective heater for each memory cell of its respective pair of memory cells.

15. The method of claim 13 , wherein remapping the data word comprises changing a bit order of the data word.

16. The method of claim 15 , wherein changing the bit order of the data word comprises moving a bit of the data word that is to be programmed to a bit location of the data word containing a bit of the data word that is not to be programmed.

17. The method of claim 13 , further comprising arranging the bit pairs such that all bit pairs whose bits are both to be programmed are programmed to respective pairs of memory cells of the memory sharing the resistance variable material and separated by the first distance.

18. The method of claim 14 , wherein programming the particular bit pair, whose bits are both to be programmed, to its respective pair of memory cells comprises changing a resistance of the resistance variable material for each memory cell of its respective pair of memory cells.