Printed circuit boards having profiled conductive layer and methods of manufacturing same
View Patent ↗A multilayer printed circuit board is provided. The multilayer printed circuit board includes a core, a first conductive layer coupled to the core, an insulating layer covering the first conductive layer, and a second conductive layer spaced from the first conductive layer by the insulating layer. The first conductive layer includes a first portion having a first thickness and a second portion having a second thickness greater than the first thickness. The second conductive layer is electrically coupled to the second portion of the first conductive layer by a conductive via extending through the insulating layer.
1. A multilayer printed circuit board comprising:
a core comprising a first side and an opposing second side;
a first conductive layer coupled to said core, said first conductive layer comprising a first portion having a first thickness and a second portion having a second thickness greater than the first thickness, each of said first portion and said second portion extending from a first surface of said first side of said core;
a single insulating layer covering said first conductive layer; and
a second conductive layer spaced from said first conductive layer by said insulating layer, wherein said second conductive layer is an outermost conductive layer of said printed circuit board and comprises a conductive foil defining a plurality of conductive traces, wherein at least one conductive trace of said plurality of conductive traces is electrically coupled to said second portion of said first conductive layer by a conductive via distinct from said second portion and extending through said insulating layer, and wherein said first portion is isolated from said second conductive layer by said insulating layer.
2. A printed circuit board in accordance with claim 1 , wherein said plurality of conductive traces includes at least one pair of conductive traces having a center-to-center spacing of less than about 0.025 inches.
3. A printed circuit board in accordance with claim 1 , wherein said at least one conductive trace has a current-carrying capacity of between about 1 ampere and about 200 amperes.
4. A printed circuit board in accordance with claim 1 , wherein said second conductive layer is substantially planar.
5. A printed circuit board in accordance with claim 4 , wherein said second conductive layer has a substantially uniform thickness of less than about 0.0035 inches.
6. A printed circuit board in accordance with claim 1 , wherein the second thickness is between about 0.001 inches and about 0.008 inches greater than the first thickness.
7. A printed circuit board in accordance with claim 6 , wherein each of the first thickness and the second thickness is between about 0.0014 inches and about 0.028 inches.
8. A printed circuit board in accordance with claim 1 , wherein said first conductive layer is an inner conductive layer.
9. A printed circuit board in accordance with claim 1 , wherein said first portion is separated from said second conductive layer by a first thickness of said insulating layer, wherein said second portion is separated from said second conductive layer by a second thickness of said insulating layer that is less than the first thickness of the insulating layer, and wherein said insulating layer comprises a single insulating layer defining the first thickness and the second thickness.
10. A printed circuit board assembly comprising:
a printed circuit board comprising:
a core;
a first conductive layer coupled to said core, said first conductive layer comprising a first portion having a first thickness and a second portion having a second thickness greater than the first thickness;
a single insulating layer covering said first conductive layer; and
a second conductive layer spaced from said first conductive layer by said insulating layer, said second conductive layer electrically coupled to said second portion of said first conductive layer by a conductive via extending through said insulating layer, wherein said first portion is isolated from said second conductive layer by said insulating layer; and
an electronic component comprising a pair of conductive leads coupled to said second conductive layer, said pair of conductive leads having a center-to-center spacing of less than about 0.025 inches.
11. A printed circuit board assembly in accordance with claim 10 , wherein said second conductive layer comprises a plurality of conductive traces, each of said conductive leads coupled to one of said conductive traces, wherein at least one of said plurality of conductive traces has a current-carrying capacity of between about 1 ampere and about 200 amperes.
12. A printed circuit board assembly in accordance with claim 11 , wherein each of said plurality of conductive traces is substantially co-planar with one another.
13. A printed circuit board assembly in accordance with claim 11 , wherein said second conductive layer has a substantially uniform thickness of less than about 0.0035 inches.