LED light source packaging method, LED light source package structure and light source module
A method for packaging LED light source, a package structure of LED light source and a light source module are provided. The method for packaging LED light source includes providing a substrate integrated with LED chips, where a surface of the substrate is provided with a filling layer configured to cover the LED chips; printing, on the a surface of the filling layer, phosphor patterns to cover the surface of the filling layer, where the phosphor patterns include one or more first phosphor patterns, one or more second phosphor patterns and one or more third phosphor patterns, where every two of the first, the second and the third phosphor patterns are adjacent to each other. The package structure of LED light source and the light source module have good uniformity of light-emission and low cost, and the process of the method for packaging LED light source is simple.
1. A method for packaging LED light source, comprising:
providing a substrate integrated with LED chips, wherein a surface of the substrate is provided with a filling layer configured to cover the LED chips; and
forming, on a surface of the filling layer, phosphor patterns to cover the surface of the filling layer, wherein the phosphor patterns comprise one or more first phosphor patterns, one or more second phosphor patterns and one or more third phosphor patterns, wherein every two of the first, the second and the third phosphor patterns are adjacent to each other.
2. The method according to claim 1 , wherein the first phosphor pattern is red, yellow, green or yellowish green phosphor pattern, the second phosphor pattern is red, yellow, green or yellowish green phosphor pattern, and the third phosphor pattern is red, yellow, green or yellowish green phosphor pattern.
3. The method according to claim 2 , wherein the red, yellow and green phosphor patterns are all regular hexagon-shaped or square-shaped, every two of the red, yellow and green phosphor patterns are adjacent to each other, and lines jointing centers of the red, yellow and the green phosphor patterns form an equilateral triangle.
4. The method according to claim 1 , wherein a color temperature and a color rendering index of light-emission are controlled by adjusting thicknesses of the first, the second and the third phosphor patterns.
5. The method according to claim 1 , wherein the method further comprises:
forming, on the surface of the substrate, a transparent dam doped with phosphors around the LED chips.
6. The method according to claim 1 , wherein the LED chips are integrated to the substrate by eutectic technology, metal welding or wire-binding.
7. The method according to claim 6 , wherein in a case that the LED chips are of a horizontal-structure, the LED chips are integrated to the substrate by means of wire-binding.
8. The method according to claim 7 , wherein the method comprises forming a metallic bead at a positive terminal of the LED chip with the horizontal-structure; and wiring from a negative terminal to the metallic bead at the positive terminal.
9. The method according to claim 7 , wherein the method comprises wiring from a negative terminal of the LED chip with the horizontal-structure to a positive terminal to be connected to the negative terminal; and planting a metallic bead on a surface of the positive terminal after the wiring.
10. The method according to claim 7 , wherein the method comprises forming a metallic bead at a positive terminal of the LED chip with the horizontal-structure; wiring from a negative terminal to the metallic bead at the positive terminal; and planting a metallic bead on a surface of the positive terminal after the wiring.
11. The method according to claim 9 , wherein a connecting wire formed by the wiring has a fishtail-shaped end.
12. A package structure of LED light source, comprising:
a substrate integrated with LED chips;
a filling layer, which is disposed on a surface of the substrate and covers the LED chips; and
phosphor patterns covering a surface of the filling layer, wherein the phosphor patterns comprise one or more first phosphor patterns, one or more second phosphor patterns and one or more third phosphor patterns, wherein every two of the first, the second and the third phosphor patterns are adjacent to each other.
13. The package structure according to claim 12 , wherein the first phosphor pattern is red, yellow, green or yellowish green phosphor pattern, the second phosphor pattern is red, yellow, green or yellowish green phosphor pattern, and the third phosphor pattern is red, yellow, green or yellowish green phosphor pattern.
14. The package structure according to claim 13 , wherein the red, yellow and green phosphor patterns are all regular hexagon-shaped or square-shaped, every two of the red, yellow and green phosphor patterns are adjacent to each other, and lines jointing centers of the red, yellow and the green phosphor patterns form an equilateral triangle.
15. The package structure according to claim 12 , wherein the package structure further comprises a transparent dam doped with phosphors, which is disposed on the surface of the substrate and around the LED chips.
16. The package structure according to claim 12 , wherein in a case that the LED chips are integrated to the substrate by means of wire-binding, the package structure of the LED light source further comprises a metallic bead disposed at a positive terminal of a first LED chip, and a binding wire connecting a negative terminal of a second LED chip to the metallic bead at the positive terminal of the first LED chip.
17. The package structure according to claim 12 , wherein in a case that the LED chips are integrated to the substrate by means of wire-binding, the package structure of the LED light source further comprises a binding wire connecting a positive terminal of a first LED chip to a negative terminal of a second LED chip, and a metallic bead overlaying the binding wire at the positive terminal of the first LED chip.
18. The package structure according to claim 12 , wherein in a case that the LED chips are integrated to the substrate by means of wire-binding, the package structure of the LED light source further comprises a metallic bead disposed at a positive terminal of a first LED chip, a binding wire connecting a negative terminal of a second LED chip to the metallic bead at the positive terminal of the first LED chip, and a metallic bead overlaying the binding wire at the positive terminal of the first LED chip.
19. A light source module, comprising:
a substrate;
one or more LED chips integrated onto a surface of the substrate, wherein the one or more LED chips are arranged in queues, and LED chips in a queue are sequentially connected;
input ports arranged at periphery of the substrate, wherein an amount of the input ports is equal to an amount of the queues, and the input ports are connected electrically to corresponding queues of LED chips, wherein the input ports are connected to an external power supply, and a brightness of the light source module is controlled by enabling any queue of LED chips to emit light in response to a control to the power supply;
a filling layer, which is disposed on the surface of the substrate and covers the LED chips; and
phosphor patterns covering a surface of the filling layer, wherein the phosphor patterns comprise one or more red phosphor patterns, one or more yellow phosphor patterns and one or more green phosphor patterns, wherein every two of the red, yellow and green phosphor patterns are adjacent to each other.
20. The light source module according to claim 19 , wherein the light source module further comprises a transparent dam doped with phosphors which is disposed on the surface of the substrate and around the LED chips.