Metal-insulator-semiconductor devices based on surface plasmon polaritons
Apparatus and techniques are presented such as can be used for electro-optic modulation and detection or other applications. For example, an optical metal grating is disposed on a thin metal film to couple light from broadside to the metal film as surface plasmon-polariton waves; below the metal film is located a thin insulating layer and a doped semiconductor region forming a metal-insulator-semiconductor structure. The device can be configured to operate as a reflection or transmission modulator, or as a photodetector, for example. Modulating the voltage applied to the metal-insulator-semiconductor structure modulates the carrier concentration in the semiconductor near the insulating layer, which modulates the refractive index of the semiconductor in this region, thus modulating the coupling efficiency to the surface plasmon-polaritons, thus modulating the reflectance and transmittance of the device. Modulated incident light produces a modulated photocurrent under bias which may be detected using electronics.
1. An optical device, comprising:
an electrically-conductive film layer coupleable to a first node of a bias circuit;
an insulating layer coupled to a first surface of the electrically-conductive film layer;
a semiconductor region coupled to the insulating layer, the semiconductor region coupleable to a second node of the bias circuit; and
a plurality of grating bumps coupled to a second surface of the electrically-conductive film layer opposite the first surface, the plurality of grating bumps comprising a material having a relatively higher free charge carrier density as compared to the insulating layer;
wherein the grating bumps are configured to couple optical energy having a wavelength in a specified range to the electrically-conductive film layer in a surface plasmon-polariton mode propagating along the electrically-conductive film layer including a field component that permeates the insulating layer and at least part of the semiconductor region.
2. The optical device of claim 1 , wherein the grating bumps comprise an electrically-conductive material including at least one of a metal, a semi-metal, or a highly n- or p-doped semiconductor material.
3. The optical device of claim 1 , wherein the electrically-conductive film layer comprises at least one of a metal, a semi-metal, or a highly n- or p-doped semiconductor.
4. The optical device of claim 1 , wherein the electrically-conductive film layer comprises a single metal or a combination of metals.
5. The optical device of claim 1 , wherein the electrically-conductive film layer comprises at least one of Cu or Al configured for integration into a silicon electronic wafer.
6. The optical device of claim 1 , wherein the electrically-conductive film layer comprises at least one of Cu, Au, Ag, Al, or Cr, configured for an optical communication or biosensor application.
7. The optical device of claim 1 , wherein the electrically-conductive film layer comprises a metal silicide.
8. The optical device of claim 1 , wherein the electrically-conductive film layer comprises a semiconductor.
9. The optical device of claim 1 , wherein the electrically-conductive film layer comprises at least one of TiN or TaN.
10. The optical device of claim 1 , wherein the insulating layer comprises at least one of HfO 2 , SiO 2 , or Si 3 N 4 .
11. The optical device of claim 1 , wherein the semiconductor region comprises n- or p-doped Si.
12. The optical device of claim 1 , comprising a cover insulator including at least one of air, SiO 2 , Si 3 N 4 , or PMMA.
13. The optical device of claim 1 , further comprising the bias circuit; and
wherein the electrically-conductive film layer is coupled to the first node of the bias circuit;
wherein the semiconductor region is coupled to the second node of the bias circuit; and
wherein the bias circuit is configured to apply a voltage between the first and second nodes.
14. The optical device of claim 13 , further comprising a modulation circuit configured to apply a modulation signal to the first and second nodes including driving the optical device into a specified inversion or accumulation state in a time-varying manner to modulate a refractive index of the semiconductor region.
15. An electro-optical system, comprising:
a bias circuit configured to apply a voltage between a first node and a second node; and
an optical device, comprising:
an electrically-conductive film layer coupled to the first node of the bias circuit;
an insulating layer coupled to a first surface of the electrically-conductive film layer;
a semiconductor region coupled to the insulating layer, the semiconductor region coupled to the second node of the bias circuit;
a plurality of grating bumps coupled to a second surface of the electrically-conductive film layer opposite the first surface, the plurality of grating bumps comprising a material having a relatively higher free charge carrier density as compared to the insulating layer; and
a cover insulator including at least one of air, SiO 2 , Si 3 N 4 , or PMMA;
wherein the grating bumps are configured to couple optical energy having a wavelength in a specified range to the electrically-conductive film layer in a surface plasmon-polariton mode propagating along the electrically-conductive film layer including a field component that permeates the insulating layer and at least part of the semiconductor region;
wherein the insulating layer comprises at least one of SiO 2 , HfO 2 and Si 3 N 4 , the grating bumps comprise at least one of Cu, Au, Ag, Al, Cr, TiN, TaN or a metal silicide, and the electrically-conductive film layer comprises at least one of Cu, Au, Ag, Al, Cr, TiN, TaN or a metal silicide.
16. A method of forming an optical device, comprising:
forming an electrically-conductive film layer coupleable to a first node of a bias circuit;
forming an insulating layer coupled to a first surface of the electrically-conductive film layer;
forming a semiconductor region coupled to the insulating layer, the semiconductor region coupleable to a second node of the bias circuit; and
forming a plurality of grating bumps coupled to a second surface of the electrically-conductive film layer opposite the first surface, the plurality of grating bumps comprising a material having a relatively higher free charge carrier density as compared to the insulating layer;
wherein the grating bumps are configured to couple optical energy having a wavelength in a specified range to the electrically-conductive film layer in a surface plasmon-polariton mode propagating along the electrically-conductive film layer including a field component that permeates the insulating layer and at least part of the semiconductor region.
17. The method of claim 16 , wherein the insulating layer comprises at least one of HfO 2 , SiO 2 , or Si 3 N 4 .
18. The method of claim 16 , wherein the semiconductor region comprises n- or p-doped Si.
19. The method of claim 16 , comprising providing a cover insulator including at least one of providing an air-based cover insulator, or forming one or more of a SiO 2 , Si 3 N 4 , or PMMA cover insulator.
20. The method of claim 16 , wherein the grating bumps comprise an electrically-conductive material, and wherein the electrically-conductive film and the grating bumps include at least one of a metal, a semi-metal, or a highly n- or p-doped semiconductor material.