Stiffener tape for electronic assembly
Some example forms relate to a stiffener tape for a wafer. The stiffener tape includes a mounting tape and a stiffener removably attached to the mounting tape. The stiffener tape further includes a die attach film attached to the stiffener. Other example forms relate to an electronic assembly that includes a wafer and a stiffener tape attached to the wafer. The stiffener tape includes a die attach film mounted to the wafer. A stiffener is attached to the die attach film and a mounting tape is removably attached to the stiffener. Still other example forms relate to a method that includes forming a stiffener tape which includes a mounting tape, a stiffener removably attached to the mounting tape and a die attach film attached to the stiffener.
1. A stiffener tape for a wafer, the stiffener tape comprising:
a mounting tape;
a metallic stiffener removably attached to the mounting tape; and
a die attach film attached to the stiffener, wherein the mounting tape, the die attach film and the metallic stiffener are formed into a roll and the metallic stiffener is between the mounting tape and the die attach film.
2. The stiffener tape of claim 1 , wherein the mounting tape is a polymer film.
3. The stiffener tape of claim 1 , wherein the die attach film is an adhesive.
4. The stiffener tape of claim 1 , wherein the metallic stiffener is a metal foil.
5. The stiffener tape of claim 1 , wherein a size of the metallic stiffener is larger than a size of the wafer.
6. A method comprising forming a stiffener tape into a roll, wherein the stiffener tape includes a mounting tape, a metallic stiffener removably attached to the mounting tape and a die attach film attached to the metallic stiffener such that the metallic stiffener is between the mounting tape and the die attach film.
7. The method of claim 6 , further comprising:
unrolling the roll of stiffener tape; and
attaching the stiffener tape to a wafer.
8. The method of claim 7 , further comprising attaching a back-grind tape to the wafer before attaching the stiffener tape to the wafer.
9. The method of claim 8 , further comprising thinning the wafer after attaching the back-grind tape to the wafer.
10. The method of claim 9 , wherein attaching the stiffener ape to the wafer includes attaching the stiffener tape to the thinned wafer.
11. The method of claim 10 , further comprising removing the back-grind tape from the thinned wafer.
12. The method of claim 7 , further comprising singulating the wafer.
13. The method of claim 12 , wherein singulating the wafer includes dicing the wafer with two cutting blades.
14. A method comprising:
forming a stiffener tape that includes a mounting tape, a metallic stiffener removably attached to the mounting tape and a die attach film attached to the metallic stiffener, wherein the metallic stiffener is between the mounting tape and the die attach film; and
attaching the stiffener tape to the wafer.
15. The method of claim 14 , further comprising attaching a back-grind tape to the wafer before attaching the stiffener tape to the wafer.
16. The method of claim 14 , further comprising:
thinning the wafer after attaching the back-grind tape to the wafer;
removing the back-grind tape from the thinned wafer; and
singulating the wafer.