Filling materials and methods of filling through holes for improved adhesion and hermeticity in glass substrates and other electronic components
View Patent ↗A paste material for filling a through-hole for improved adhesion and hermeticity in glass substrates. In some embodiments, the paste material comprises a metal, a glass frit composition, a solvent, a resin, a conductive or non-conductive inert additive, or mixtures thereof. The paste material has improved adhesion to the through-holes. The filled through-holes are hermetic and have a low resistivity.
1. A paste material for filling a through-hole, said paste material comprising:
a. a Cu powder having a particle size ranging from 2 to 10 microns for D50;
b. a glass frit composition comprising oxides and compounds of Pb, wherein a glass frit particle size of the glass frit composition ranges from 6 to 24 microns for D50;
c. an ester alcohol solvent;
d. an ethyl cellulose resin; and
e. a non-conductive Al 2 O 3 additive and a conductive molybdenum additive;
wherein the paste material has an improved adhesion to the through-hole, wherein the solvent maintains a paste consistency of the paste material when filling the through-hole; and wherein the through-hole filled with the paste material is hermetic.
2. The paste material of claim 1 , wherein the Cu powder comprises a pure Cu metal powder.
3. The paste material of claim 1 , wherein the PbO glass frit composition is 6 to 12% of the paste and comprises a mixture of glass frits.
4. The paste material of claim 1 , wherein the ethyl cellulose resin is natural.
5. The paste material of claim 1 , wherein the paste material is mixed and dispersed using a three roll mill, thick film technology, or a combination thereof.
6. The paste material of claim 1 , wherein the paste material fills the hole by printing.
7. The paste material of claim 1 , wherein the filled hole is cured and fired in a nitrogen environment.