Patent Assignment
Reel/Frame 036948/0803
Conditional Assignment
Recorded: 2015-11-03
Pages: 14
Assignor
TRITON MICROTECHNOLOGIES INC.
Executed: 2015-04-27
Assignee
ASAHI GLASS CO., LTD.
5-1, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-8405, JAPAN
Covered Properties
(3)
Low Cost and High Performance Bonding of Wafer to Interposer & Method of Forming Vias and Circuits
Filling Materials and Methods of Filling Through Holes for Improved Adhesion and Hermeticity in Glass Substrates and Other Electronic Components
Patent:
9,236,274 →
Application:
14/568,842 →
Filling Materials and Methods of Filling Through Holes for Improved Adhesion and Hermeticity in Glass Substrates and Other Electronic Components
Patent:
9,374,892 →
Application:
14/568,917 →
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 13, 2014
From: MOBLEY, TIM
To: NMODE SOLUTIONS, INC.
Reel/Frame 031953/0848 →
Assignment of Assignor's Interest
Aug 29, 2014
From: NMODE SOLUTIONS, INC.
To: TRITON MICROTECHNOLOGIES
Reel/Frame 033641/0675 →
Assignment of Assignor's Interest
Dec 12, 2014
From: MOBLEY, TIM; KEUSSEYAN, ROUPEN LEON
To: TRITON MICROTECHNOLOGIES
Reel/Frame 034498/0217 →
Change of Name
Aug 7, 2018
From: ASAHI GLASS COMPANY, LIMITED
To: AGC INC.
Reel/Frame 046730/0786 →