Patent Assignment
Reel/Frame 033641/0675
Assignment of Assignor's Interest
Recorded: 2014-08-29
Pages: 2
Assignor
NMODE SOLUTIONS, INC.
Executed: 2012-12-31
Assignee
TRITON MICROTECHNOLOGIES
8950 N. ORACLE ROAD, STE. 100, TUCSON, ARIZONA, 85704
Covered Properties
(2)
Low Cost and High Performance Bonding of Wafer to Interposer & Method of Forming Vias and Circuits
Low Cost and High Performance Bonding of Wafer to Interposer & Method of Forming Vias and Circuits
Application:
61/554,417 →
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 13, 2014
From: MOBLEY, TIM
To: NMODE SOLUTIONS, INC.
Reel/Frame 031953/0848 →
Assignment of Assignor's Interest
Jul 17, 2014
From: MOBLEY, TIM
To: NMODE SOLUTIONS, INC.
Reel/Frame 033334/0312 →
Conditional Assignment
Nov 3, 2015
From: TRITON MICROTECHNOLOGIES INC.
To: ASAHI GLASS CO., LTD.
Reel/Frame 036948/0803 →
Change of Name
Aug 7, 2018
From: ASAHI GLASS COMPANY, LIMITED
To: AGC INC.
Reel/Frame 046730/0786 →