IP Library Assignment 031953/0848
Patent Assignment
Reel/Frame 031953/0848

Assignment of Assignor's Interest

Recorded: 2014-01-13 Pages: 2
Assignor
MOBLEY, TIM
Executed: 2014-01-08
Assignee
NMODE SOLUTIONS, INC.
8950 N. ORACLE RD., SUITE 100, ORO VALLEY, ARIZONA, 85704
Covered Property (1)
Low Cost and High Performance Bonding of Wafer to Interposer & Method of Forming Vias and Circuits
Patent: 9,111,917 →
Application: 13/666,089 →
Publication: US 2013/0105211
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 29, 2014
From: NMODE SOLUTIONS, INC.
To: TRITON MICROTECHNOLOGIES
Reel/Frame 033641/0675 →
Conditional Assignment Nov 3, 2015
From: TRITON MICROTECHNOLOGIES INC.
To: ASAHI GLASS CO., LTD.
Reel/Frame 036948/0803 →
Change of Name Aug 7, 2018
From: ASAHI GLASS COMPANY, LIMITED
To: AGC INC.
Reel/Frame 046730/0786 →