IP Library › Patent Application 61554417
Patent Application Provisional Small
App. No. 61/554,417 · Confirmation No. 1848

LOW COST AND HIGH PERFORMANCE BONDING OF WAFER TO INTERPOSER & METHOD OF FORMING VIAS AND CIRCUITS

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2012-10-26 PET.STATUS Petition for review/processing depending on status 2 View
2012-10-26 AF/D Affidavit-submitted prior to Mar 15, 2013 1 View
2012-10-26 WFEE Fee Worksheet (SB06) 2 View
2012-10-26 N417 Electronic Filing System Acknowledgment Receipt 2 View
2011-11-09 APP.FILE.REC Filing Receipt 3 View
2011-11-01 TR.PROV Provisional Cover Sheet (SB16) 3 View
2011-11-01 SPEC Specification 5 View
2011-11-01 CLM Claims 2 View
2011-11-01 DRW Drawings-only black and white line drawings 1 View
2011-11-01 WFEE Fee Worksheet (SB06) 2 View
2011-11-01 N417 Electronic Filing System Acknowledgment Receipt 3 View
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Quick Facts
App. No.
61/554,417
Filed
2011-11-01