Assignment of Assignor's Interest

Recorded: 2014-07-17 Pages: 3

Assignor

MOBLEY, TIM

Executed: 2014-07-03

Assignee

NMODE SOLUTIONS, INC.

8950 N. ORACLE ROAD, ORO VALLEY, ARIZONA, 85704

Covered Property (1)

Low Cost and High Performance Bonding of Wafer to Interposer & Method of Forming Vias and Circuits

Application: 61/554,417 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.