Printed wiring board and information processing apparatus
A printed wiring board having a land for surface-mounting of an electronic component, includes the land having a pair of land pieces arranged in an opposing manner, and each of the land pieces including a plurality of land portions having widths different from each other, and a coupling portion partially coupling a boundary portion between a pair of adjacent ones of the land portions.
1. A printed wiring board having a land for surface-mounting of an electronic component, comprising:
the land having a pair of land pieces arranged in an opposing manner, and
each of the land pieces including
a plurality of land portions having widths different from each other, and
a coupling portion partially coupling a boundary portion between a pair of adjacent ones of the land portions, wherein
in the boundary portion between the pair of land portions, a plurality of resist portions for suppressing a flow of solder between the pair of land portions are arranged along a width direction of the land pieces, and the coupling portion is disposed between adjacent ones of the resist portions.
2. The printed wiring board according to claim 1 , wherein in the boundary portion between the pair of land portions, a plurality of the coupling portions are arranged along the width direction.
3. The printed wiring board according to claim 1 , wherein widths of the plurality of land portions in the land pieces respectively correspond to widths of a plurality of electronic components having different sizes.
4. An information processing apparatus including a printed wiring board having a land for surface-mounting of an electronic component, wherein
the land has a pair of land pieces, and
each of the land pieces includes
a plurality of land portions having widths different from each other, and
a coupling portion partially coupling a boundary portion between a pair of adjacent ones of the land portions, and wherein
in the boundary portion between the pair of land portions, a plurality of resist portions for suppressing a flow of solder between the pair of land portions are arranged along a width direction of the land pieces, and the coupling portion is disposed between adjacent ones of the resist portions.