Cavities containing multi-wiring structures and devices
A method is disclosed for making an interconnection component. The steps include forming a mask layer covering a first opening in a sheet-like element that has first and second opposed surfaces; forming a plurality of mask openings in the mask layer, wherein the first opening and a portion of the first surface are partly aligned with each mask opening; and forming electrical conductors on spaced apart portions of the first surface and on spaced apart portions of the interior surface within the first opening which are exposed by the mask openings. The element may consist essentially of a material having a coefficient of thermal expansion of less than 10 parts per million per degree Celsius. Each conductor may extend along an axial direction of the first opening and the first conductors may be fully separated from one another within the first opening.
1. A method for making an interconnection component comprising:
forming a resist layer overlying a first surface of a sheet-like element and at least partially filing a first opening in the sheet-like element, the sheet-like element having a second opposed surface, the element consisting essentially of a material having a coefficient of thermal expansion of less than 10 parts per million per degree Celsius;
forming a mask layer covering the resist layer that overlies the sheet-like element and that at least partially fills the first opening in the sheet-like element;
forming a plurality of mask openings in the mask layer, wherein the plurality of mask openings are partly aligned with at least a portion of the resist layer overlying the first surface and at least a portion of the resist layer filling the first opening;
forming resist openings that extend through those portions of the resist layer exposed through the mask openings and that at least partially fill the first opening, such that the resist openings extend between the first and second surfaces of the element; and
forming electrical conductors on spaced apart portions overlying the first surface and on spaced apart portions within the resist openings within the first opening that are exposed through the mask openings, each conductor extending along an axial direction of the first opening, the electrical conductors being fully separated from one another within the first opening.
2. The method of claim 1 , wherein the element includes forming a dielectric layer between the resist layer and the element, the dielectric layer having a second opening aligned with the first opening of the element and the resist openings.
3. The method of claim 2 , further comprising forming a dielectric layer overlying an interior surface of the first opening of the element.
4. The method of claim 3 , wherein the resist layer overlies the dielectric layer.
5. The method of claim 1 , wherein the plurality of mask openings is four mask openings, and wherein each of the four mask openings are partly aligned with the first opening.
6. The method of claim 1 , wherein the electrical conductors include first and second electrical conductors, and wherein the first conductor carries a first potential different from a second potential carried by the second conductor.
7. The method of claim 1 , further comprising forming the electrical conductors overlying the second surface of the sheet-like element.
8. The method of claim 1 , wherein the first opening is a plurality of first openings.