Solid state deposition methods, apparatuses, and products
The described embodiments relate generally to methods for forming structures by solid state deposition processes. More specifically a method for depositing cold spray over a removable body is disclosed. Methods are also disclosed for affixing operational and structural components to a surface of a device housing with cold spray.
1. A method for forming a metallic structure on a substrate having protruding members, the method comprising:
forming a metallic layer by using a solid-state deposition process to spray metallic particles over the protruding members and over a sacrificial body having a volume that is positioned between the protruding members;
forming the metallic structure by shaping an outer surface of the metallic layer using a machining process; and
forming a void defined by the metallic structure, the protruding members, and the substrate by reducing the volume of the sacrificial body.
2. The method as recited in claim 1 , wherein the volume of the sacrificial body is generally unchanged during the shaping of the outer surface of the metallic layer.
3. The method of claim 1 , wherein top and side surfaces of the protruding members are covered by the metallic structure.
4. The method of claim 1 , wherein the volume of the sacrificial body is reduced by using at least one of dissolving the sacrificial body or melting the sacrificial body.
5. The method of claim 3 , wherein the top and side surfaces of the protruding members are unaltered during the shaping of the outer surface.
6. The method of claim 1 , wherein a void volume corresponds to at least an amount of reduction of the volume of the sacrificial body.
7. The method of claim 1 , wherein the sacrificial body has a higher melting point than a temperature at which the metallic particles are sprayed.
8. The method of claim 1 , wherein, during spraying the metallic particles, the sacrificial body includes an indentation characterized as having a rib structure that is at least partially filled with the metallic particles such that upon altering the sacrificial body, the metallic particles within the indentation form a corresponding rib structure.
9. The method of claim 1 , wherein at least a portion of the sacrificial body includes material having a lower melting point than a melting point of the metallic layer.
10. A method of electrically isolating an electrical component within a metallic structure, the method comprising:
forming the metallic structure by using a solid-state deposition process to deposit metallic particles over protruding members that are included on a substrate and over a sacrificial body positioned between the protruding members, wherein an electrical component is secured to the substrate and embedded within the sacrificial body, and the metallic particles act as a conductive shield that inhibits electromagnetic energy from passing through the metallic structure to interfere with the electrical component;
shaping an outer surface of the metallic structure by using a machining process; and
forming a void defined by the metallic structure, the protruding members, and the substrate by altering the sacrificial body such as to reduce a volume of the sacrificial body, wherein the electrical component remains secured to the substrate and within the void subsequent to forming the void.
11. The method of claim 10 , wherein the metallic structure is a structural rib.
12. The method of claim 10 , wherein altering of the sacrificial body comprises heating the sacrificial body to a first melting temperature that is less than a second melting temperature associated with the metallic structure.
13. The method of claim 10 , wherein the metallic structure includes at least one opening configured to allow passage of RF energy through the metallic structure.
14. The method of claim 10 , wherein the metallic structure covers top and side surfaces of the protruding members.