IP Library Granted Patent US 9,240,531
Granted Patent B2
US 9,240,531 · App. 14/579,203 · Granted Jan 19, 2016

Light emitting device including reinforcing member

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Quick Facts
Patent No.
US 9,240,531
App. No.
14/579,203
Granted
Jan 19, 2016
Kind
B2
Abstract

A semiconductor light-emitting device includes a semiconductor light-emitting layer, a pair of electrodes, a fluorescent material layer and a chromaticity adjusting layer. The semiconductor light-emitting layer emits first light. The pair of electrodes is connected to the semiconductor light-emitting layer. The fluorescent material layer covers at least a center portion of the semiconductor light-emitting layer, and contains a fluorescent material to absorb the first light and radiate second light. The chromaticity adjusting layer covers at least a peripheral portion of the semiconductor light-emitting layer, is exposed to outside, and contains a fluorescent material with a concentration lower than a concentration of the fluorescent material in the fluorescent material layer.

Claims (15)

1. A semiconductor light-emitting device, comprising:

a semiconductor light-emitting layer to emit first light;

a pair of electrodes connected to the semiconductor light-emitting layer;

a fluorescent material layer disposed above the semiconductor light-emitting layer and containing a fluorescent material to absorb the first light and radiate second light;

a reinforcement resin layer disposed below the semiconductor light-emitting layer; and

an anchor member having one end portion to intrude into the fluorescent material layer and another end portion to intrude into the reinforcement resin layer.

2. The semiconductor light-emitting device according to claim 1 , further comprising a chromaticity adjusting layer to cover at least a peripheral portion of the semiconductor light-emitting layer, being transparent resin containing a fluorescent material with a concentration lower than a concentration of the fluorescent material in the fluorescent material layer.

3. The semiconductor light-emitting device according to claim 1 , wherein the pair of electrodes is exposed at a side surface parallel to an aligning direction of the pair of electrodes.

4. The semiconductor light-emitting device according to claim 1 , wherein the anchor member is made of silicon.

5. The semiconductor light-emitting device according to claim 4 , further comprising a chromaticity adjusting layer to cover at least a peripheral portion of the semiconductor light-emitting layer, being transparent resin containing a fluorescent material with a concentration lower than a concentration of the fluorescent material in the fluorescent material layer.

6. The semiconductor light-emitting device according to claim 4 , wherein the pair of electrodes is exposed at a side surface parallel to an aligning direction of the pair of electrodes.

7. The semiconductor light-emitting device according to claim 1 , wherein the anchor member is made of same resin as the reinforcement resin layer, and is a portion of the reinforcement resin layer extending into the fluorescent material layer.

8. The semiconductor light-emitting device according to claim 7 , further comprising a chromaticity adjusting layer to cover at least a peripheral portion of the semiconductor light-emitting layer, being transparent resin containing a fluorescent material with a concentration lower than a concentration of the fluorescent material in the fluorescent material layer.

9. The semiconductor light-emitting device according to claim 7 , wherein the pair of electrodes is exposed at a side surface parallel to an aligning direction of the pair of electrodes.

10. The semiconductor light-emitting device according to claim 8 , wherein the pair of electrodes is exposed at a side surface parallel to an aligning direction of the pair of electrodes.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 6, 2020
From: TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
To: SEOUL SEMICONDUCTOR CO., LTD.
Reel/Frame 052316/0044 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 24, 2020
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA ELECTRONIC DEVICES AND STORAGE CORPORATION
Reel/Frame 051691/0442 →