Photosensitive resin composition and method for producing resist pattern
The present invention provides a photosensitive resin composition comprising: an alkali-soluble resin (A); a compound having at least one ethylenically unsaturated double bond per molecule (B); a photo radical polymerization initiator having a keto oxime ester structure (C); and a compound represented by the Formula (1) or (2) below (D); wherein the content of the photo radical polymerization initiator (C) is 0.5 to 5 times the content of the compound (D), and the content of the photo radical polymerization initiator (C) with respect to 100 parts by mass of the compound (B) is 3 to 20 parts by mass. In Formula (1), the six R 1 s each independently represent a hydrogen atom or an electron-donating group, and n represents 0 or 1. In Formula (2), the six R 2 s each independently represent a hydrogen atom or an electron-donating group, and m represents 0 or 1. By use of the photosensitive resin composition of the present invention, formation of a resist pattern having excellent resolution is possible even without using an oxygen inhibition layer. By the method for producing a resist pattern of the present invention, formation of a resist pattern having excellent resolution is possible even without using an oxygen inhibition layer.
1. A photosensitive resin composition, comprising:
(A) an alkali-soluble resin;
(B) a compound comprising an ethylenically unsaturated double bond per molecule;
(C) a photo radical polymerization initiator comprising a keto oxime ester structure; and
(D) a compound of Formula (1) or Formula (2):
wherein, in Formula (1):
each R 1 independently represents a hydrogen atom or an electron-donating group; and
n represents 0 or 1,
wherein, in Formula (2):
each R 2 independently represents a hydrogen atom or an electron-donating group; and
m represents 0 or 1,
wherein a content by mass of the photo radical polymerization initiator (C) is 0.5 to 5 times of a content by mass of the compound (D), and
wherein a content of the photo radical polymerization initiator (C) with respect to 100 parts by mass of the compound (B) is 4 to 12 parts by mass.
2. The photosensitive resin composition according to claim 1 , wherein the keto oxime ester structure of the photo radical polymerization initiator (C) is a structure represented by Formula (3):
3. A method for producing a resist pattern, the method comprising:
applying the photosensitive resin composition according to claim 2 to a base material to forma resin coating;
exposing the resin coating to obtain an exposed resin coating; and
developing the exposed resin coating using an alkaline developer to allow pattern formation.
4. The photosensitive resin composition according to claim 2 , wherein the keto oxime ester structure of the photo radical polymerization initiator (C) is bound to a pbenylcarbazole group.
5. A method for producing a resist pattern, the method comprising:
applying the photosensitive resin composition according to claim 1 to a base material to form a resin coating;
exposing the resin coating to obtain an exposed resin coating; and
developing the exposed resin coating using an alkaline developer to allow pattern formation.
6. The photosensitive resin composition according to claim 1 , wherein the content by mass of the photo radical polymerization initiator (C) is 0.6 to 4 times of the content by mass of the compound (D).
7. The photosensitive resin composition according to claim 1 , wherein the photo radical polymerization initiator (C) has formula (5):
8. The photosensitive resin composition according to claim 1 , wherein the photo radical polymerization initiator (C) has formula (6):
9. The photosensitive resin composition according to claim 1 , wherein the compound (D) has formula (1) and is selected from the group consisting of 1,4-dihydroxynaphthalene, 2,5-di-tert-butylhydroquinone, and methylhydroquinone.
10. The photosensitive resin composition according to claim 1 , wherein the compound (D) has formula (1) and is 2,5-di-tert-butylhydroquinone.
11. The photosensitive resin composition according to claim 1 , wherein the compound (D) has formula (2) and is 1,4-naphthoquinone.
12. A photosensitive resin composition, comprising:
(A) an alkali-soluble resin;
(B) a compound comprising an ethylenically unsaturated double bond per molecule;
(C) a photo radical polymerization initiator comprising a keto oxime ester structure; and
(D) a compound of Formula (1) or Formula (2):
wherein, in Formula (1):
each R′ independently represents a hydrogen atom or an electron-donating group; and
n represents 0 or 1,
wherein, in Formula (2):
each R 2 independently represents a hydrogen atom or an electron-donating group; and
m represents 0 or 1,
wherein a content by mass of the photo radical polymerization initiator (C) is 0.6 to 4 times of a content by mass of the compound (D), and
wherein a content of the photo radical polymerization initiator (C) with respect to 100 parts by mass of the compound (B) is 3 to 20 parts by mass.
13. A photosensitive resin composition, comprising:
(A) an alkali-soluble resin;
(B) a compound comprising an ethylenically unsaturated double bond per molecule;
(C) a photo radical polymerization initiator comprising a keto oxime ester structure; and
(D) a compound selected from the group consisting of 1,4-dihydroxynaphthalene, 2,5-di-tert-butylhydroquinone, methylhydroquinone, and 1,4-naphthoquinone,
wherein a content by mass of the photo radical polymerization initiator (C) is 0.5 to 5 times of a content by mass of the compound (D), and
wherein a content of the photo radical polymerization initiator (C) with respect to 100 parts by mass of the compound (B) is 3 to 20 parts by mass.