IP Library Granted Patent US 9,788,100
Granted Patent B2
US 9,788,100 · App. 14/590,421 · Granted Oct 10, 2017

Headphones with slidable lead element in earphone housings

Inventors: Mohamad Essabar (Ballerup, DK); Peter Vestergaard Værum (Ballerup, DK); Bo Skjoldborg (Ballerup, DK); Christian Ern (Ballerup, DK)
Assignee: SENNHEISER COMMUNICATIONS A/S
H04R1/1058H04R1/105H04R1/1033H04R5/0335
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Quick Facts
Patent No.
US 9,788,100
App. No.
14/590,421
Granted
Oct 10, 2017
Kind
B2
Abstract

A headphone with over the head passage and two earphone housings is provided, with one housing attached at each end of the over the head passage at attachment areas thereof, and an electrical lead element passing between the over the head passage and the earphone housing. The over the head passage is connected at the attachment area to an earphone housing at an earphone attachment site arranged externally of the earphone housing, and the earphone housing comprise a lead element opening spaced from the earphone attachment site. The lead element opening is larger than the electrical lead element and the lead element is slidably arranged in the lead element opening.

Claims (14)

1. Headphone with over-the-head passage and two earphone housings, one housing of the two earphone housings attached at each end of the over-the-head passage at attachment areas thereof, and an electrical lead element passing between the over-the-head passage and each of the two earphone housings, wherein the over the head passage is connected on each end at a respective attachment area of the attachment areas to a respective earphone housing of the two earphone housings at an earphone attachment site arranged externally of the respective earphone housing, and whereby each earphone housing comprises a lead element opening spaced from the earphone attachment site whereby the lead element opening is larger than the electrical lead element and the lead element is slidably arranged to slide in the lead element opening when a user of the headphone adjusts the position of each earphone housing, wherein

the earphone attachment site comprises a sliding element which is arranged to slide along the respective attachment area of the over-the-head passage,

each attachment area comprises a rectangular window with respective upper and a lower short parallel opposed frame parts and respective long parallel opposed frame parts interconnecting the short parallel opposed frame parts and wherein the rectangular window comprises an inner side adapted to face the head and an outer side adapted to face away from the head of the user when the headphone is used, and the sliding element comprises an inner pressure plate and an outer pressure plate respectively which urge friction control pads towards the long parallel frame parts of the rectangular window.

2. Headphone with over the head passage as claimed in claim 1 , wherein the lead element opening is provided in an upper part of each earphone housing, whereby this upper part is defined by being adjacent to the over the head passage.

3. Headphone with over the head passage as claimed in claim 2 , wherein the lead element passes from the lead element opening in each earphone housing and into the over the head passage at an entry point thereof above each attachment area.

4. Headphone with over the head passage as claimed in claim 3 , wherein the lead element opening in each earphone housing is provided above an open space inside each earphone housing dimensioned to accommodate a certain length of lead element, whereby this length is at least commensurate with a length of the respective attachment area of the over the head passage.

5. Headphone over the head passage as claimed in claim 4 , wherein the lead element is flexible, yet resilient enough to stay straight during motion in and out of each earphone housing through the opening, and the opening fits the contour of the lead element without pinching the lead.

6. Headphone with over the head passage as claimed in claim 3 , wherein the lead element is bendable, and wherein a pivotal link is provided and located between the entry point and the attachment areas of the over the head passage to allow the assembly of each earphone housing and each attachment area to pivot with respect to the over the head passage.

7. Headphone over the head passage as claimed in claim 6 , wherein the lead element is flexible, yet resilient enough to stay straight during motion in and out of each earphone housing through the opening, and the opening fits the contour of the lead element without pinching the lead.

8. Headphone over the head passage as claimed in claim 3 , wherein the lead element is flexible, yet resilient enough to stay straight during motion in and out of each earphone housing through the opening, and the opening fits the contour of the lead element without pinching the lead.

9. Headphone over the head passage as claimed in claim 2 , wherein the lead element is flexible, yet resilient enough to stay straight during motion in and out of each earphone housing through the opening, and the opening fits the contour of the lead element without pinching the lead.

10. Headphone with over the head passage as claimed in claim 1 , wherein the inner pressure plate comprises an opening having a rim shaped as a spherical lip and the outer pressure plate comprises a spherically shaped indent opposite the spherical lip, and wherein a ball element having ball-shaped surface parts corresponding to the spherical indent and to the spherical lip and a shaft attached to the ball shaped surface parts is arranged between the pressure plates with the shaft extending through the opening in the inner pressure plate, whereby the respective earphone housing is attached to this shaft.

11. Headphone over the head passage as claimed in claim 10 , wherein the lead element is flexible, yet resilient enough to stay straight during motion in and out of each earphone housing through the opening, and the opening fits the contour of the lead element without pinching the lead.

12. Headphone over the head passage as claimed in claim 1 , wherein the lead element is flexible, yet resilient enough to stay straight during motion in and out of each earphone housing through the opening, and the opening fits the contour of the lead element without pinching the lead.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 9, 2021
From: SENNHEISER COMMUNICATIONS A/S
To: SENNHEISER ELECTRONIC GMBH & CO. KG; EPOS GROUP A/S
Reel/Frame 055878/0109 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 3, 2015
From: ESSABAR, MOHAMAD; VAERUM, PETER VESTERGAARD; SKJOLDBORG, BO; ERN, CHRISTIAN
To: SENNHEISER COMMUNICATIONS A/S
Reel/Frame 034876/0206 →
Priority Claims (1)
EP 14150310 · Jan 7, 2014 · regional
Continuity (1)
Related Publication 20150195640A1 · Jul 9, 2015