Anti-reflection layer for back-illuminated sensor
An image sensor for short-wavelength light includes a semiconductor membrane, circuit elements formed on one surface of the semiconductor membrane, and a pure boron layer on the other surface of the semiconductor membrane. An anti-reflection or protective layer is formed on top of the pure boron layer. This image sensor has high efficiency and good stability even under continuous use at high flux for multiple years. The image sensor may be fabricated using CCD (charge coupled device) or CMOS (complementary metal oxide semiconductor) technology. The image sensor may be a two-dimensional area sensor, or a one-dimensional array sensor.
1. An image sensor for sensing at least one of deep ultraviolet (DUV) radiation, vacuum ultraviolet (VUV) radiation, extreme ultraviolet (EUV) radiation, and charged particles, the image sensor comprising:
a semiconductor membrane including circuit elements formed on a first surface of the semiconductor membrane;
a pure boron layer formed on a second surface of the semiconductor membrane; and
an anti-reflection coating consisting essentially of alumina formed on the surface of the pure boron layer, wherein an atomic-layer deposition (ALD) process is used to form the anti-reflection coating.
2. The image sensor of claim 1 , wherein the semiconductor membrane comprises an epitaxial layer between about 10 μm and about 40 μm in thickness.
3. The image sensor of claim 2 , further including a doped layer formed in the second surface of the membrane.
4. The image sensor of claim 1 , wherein the pure boron layer is between 2 nm and 3 nm thick, and wherein the alumina has a thickness of approximately 16.5 nm.
5. The image sensor of claim 1 , further comprising a handling wafer attached to the circuit elements.
6. The image sensor of claim 1 , further comprising a protective layer formed on the circuit elements.
7. The image sensor of claim 4 , wherein the image sensor comprises a charge-coupled device (CCD) or a CMOS device.
8. An image sensor for sensing at least one of deep ultraviolet (DUV) radiation, vacuum ultraviolet (VUV) radiation, extreme ultraviolet (EUV) radiation, and charged particles, the image sensor comprising:
a semiconductor substrate membrane including circuit elements formed on a first surface thereof;
a pure boron layer formed on a second surface of the semiconductor substrate; and
an anti-reflection coating formed on the pure boron layer,
wherein the pure boron layer is between 2 nm and 10 nm thick, and
wherein the anti-reflection coating consists essentially of alumina.
9. The image sensor of claim 8 ,
wherein the pure boron layer is between 2 nm and 3 nm thick, and
wherein the alumina has a thickness of approximately 16.5 nm.
10. The image sensor of claim 8 , wherein the alumina is deposited by an ALD process.