Light emitting diode and light emitting device package including the same

1. A light emitting diode comprising:

a light emitting structure including a first-conductivity-type semiconductor layer, a second-conductivity-type semiconductor layer, and an active layer disposed between the first-conductivity-type semiconductor layer and the second-conductivity-type semiconductor layer;

an electrode on the second conductivity-type semiconductor layer of the light emitting structure; and

a mask layer disposed in the first-conductivity-type semiconductor layer;

wherein the first-conductivity-type semiconductor layer includes at least one recess portion,

wherein the light emitting structure is mesa-etched from the second-conductivity-type semiconductor layer to a part of the first-conductivity-type semiconductor layer, and

wherein the mask layer is disposed in an upper part of the first-conductivity-type semiconductor layer as compared to a surface of the first-conductivity-type semiconductor layer exposed by the mesa-etching,

wherein the mask layer includes a masking region and a window region that is distinguished from the masking region, and the recess portion is to correspond to the window region, and the electrode is to correspond to the window region.

2. The light emitting diode according to claim 1 , wherein the recess portion is formed in the first-conductivity-type semiconductor layer.

3. The light emitting diode according to claim 2 , wherein the recess portion is disposed between the window region and the active layer.

4. The light emitting diode according to claim 1 , wherein the mask layer comprises at least one of SiO2 or SiN.

5. The light emitting diode according to claim 1 , wherein the mask layer is patterned such that a horizontal section shape of the patterned mask layer has a predetermined shape.

6. The light emitting diode according to claim 5 , wherein the horizontal section shape of the mask layer comprises a lattice shape, a stripe shape, a circular shape, an oval shape, or a polygonal shape.

7. The light emitting diode according to claim 1 , wherein the light emitting structure is disposed over a substrate, and the substrate comprises a light extraction structure formed at a surface of the substrate, to which the light emitting structure is adjacent.

8. The light emitting diode according to claim 1 , further comprising an electron blocking layer disposed between the active layer and the second-conductivity-type semiconductor layer.

9. The light emitting diode according to claim 1 , wherein the mask layer has a thickness of 0.01 to 1.5 μm.

10. The light emitting diode according to claim 1 , wherein the window region and the masking region have a width ratio of 1:0.1 to 10.

11. The light emitting diode according to claim 1 , wherein the recess portion is formed at a portion of an upper surface of the first-conductivity-type semiconductor layer where a threading dislocation from a lower portion of the light emitting diode reaches, wherein the masking region of the mask layer blocks at least a part of the threading dislocations advancing toward a top of the light emitting structure.

12. The light emitting diode according to claim 1 , wherein the recess portion comprises a V-pit shape, an inverted polygonal corn shape, or an inverted pyramid shape.

13. The light emitting diode according to claim 1 , wherein the active layer is formed with a recess portion corresponding to the recess portion of the first-conductivity-type semiconductor layer.

14. A light emitting device package comprising:

a package body;

first and second lead frames disposed on the package body; and

a light emitting diode disposed on the package body, and the light emitting diode being electrically connected to the first and second lead frames,

wherein the light emitting diode includes a substrate, a light emitting structure disposed on the substrate, the light emitting structure including a first-conductivity-type semiconductor layer, a second-conductivity-type semiconductor layer, and an active layer disposed between the first-conductivity-type semiconductor layer and the second-conductivity-type semiconductor layer, an electrode on the light emitting structure, and a mask layer disposed in the first-conductivity-type semiconductor layer, and

wherein the first-conductivity-type semiconductor layer is formed with at least one recess portion,

wherein the active layer is a light emitting region and the mask layer is disposed in the first-conductivity-type semiconductor layer corresponding to the light emitting region,

wherein the mask layer is disposed in an upper part of the first-conductivity-type semiconductor layer as compared to a surface of the first-conductivity-type semiconductor layer exposed by mesa-etching, and wherein the mask layer includes a masking region and a window region distinguished from the masking region, and the recess portion is to correspond to the window region, and the electrode is to correspond to the window region.

15. The light emitting device package according to claim 14 , wherein the recess portion is formed at a portion of an upper surface of the first-conductivity-type semiconductor layer where a threading dislocation from a lower portion of the light emitting diode reaches, wherein the masking region of the mask layer blocks at least a part of the threading dislocations advancing toward a top of the light emitting structure.