Passive wireless sensor including piezoelectric MEMS resonator

1. A passive wireless sensor, comprising;

a substrate having a plurality of Microelectromechanical system (MEMS) piezoelectric resonators thereon, each of said plurality of MEMS piezoelectric resonators including:

a piezoelectric layer directly between a top metal layer (top electrode layer) and a bottom metal layer (bottom electrode layer), said bottom electrode layer being on said substrate,

wherein said top electrode layer is a patterned top electrode layer including at least a first electrode for sensing an electrical signal and a second electrode for providing a ground reference; and

an antenna connected to at least one of the first electrode and said second electrode for wirelessly transmitting said electrical signal and for receiving a wireless interrogation signal,

wherein each of said plurality of said MEMS piezoelectric resonators comprises a contour-mode piezoelectric resonator that varying planar dimensions of at least one of said substrate, said bottom electrode layer, said piezoelectric layer, and said top electrode layer to collectively provide two or more different resonant frequencies.

2. The passive wireless sensor of claim 1 , wherein said antenna is on said substrate.

3. The passive wireless sensor of claim 1 , wherein said substrate has a thick substrate region and a thin substrate region, and wherein each of said plurality of MEMS piezoelectric resonators comprise a thin-film piezoelectric-on-semiconductor (TPoS) resonator on said thin substrate region including:

at least a first and a second zero displacement node provided by first and second cantilever-shaped beam support portions of said thin substrate region for tethering said MEMS piezoelectric resonator to said thick substrate region,

wherein said patterned top electrode layer includes portions over said thick substrate region, and other portions over said first and second cantilever-shaped beam support portions.

4. The passive wireless sensor of claim 1 , wherein said substrate comprises a semiconductor substrate having a 25° C. resistivity >1 ohm-cm.

5. The passive wireless sensor of claim 4 , wherein said semiconductor substrate comprises silicon.

6. The passive wireless sensor of claim 1 , wherein said piezoelectric layer is a thin film layer having a thickness between 100 nm and 5 μm.

7. The passive wireless sensor of claim 1 , wherein said top electrode layer includes an interdigitated portion.

8. A method of wirelessly sensing at least one physical parameter, comprising:

wirelessly exciting a plurality of Microelectromechanical system (MEMS) piezoelectric resonators thereon connected to an antenna into oscillation by a wireless interrogation signal,

wherein each of said plurality of said MEMS piezoelectric resonators include a piezoelectric layer directly between a top metal layer (top electrode layer) and a bottom metal layer (bottom electrode layer), said bottom electrode layer being on a substrate, wherein said top electrode layer is a patterned top electrode layer including at least a first electrode for sensing an electrical signal and a second electrode for providing a ground reference, and wherein said antenna connected to at least one of said first electrode and said second electrode for wirelessly transmitting said electrical signal and for receiving said wireless interrogation signal,

wherein each of said plurality of said MEMS piezoelectric resonators further comprises a contour-mode piezoelectric resonator that vary planar dimensions of at least one of said substrate, said bottom electrode layer, said piezoelectric layer, and said top electrode layer to collectively provide two or more different resonant frequencies,

said plurality of MEMS piezoelectric resonators providing a decay response of an amplitude of said oscillation (decay response) responsive to said wireless interrogation signal;

analyzing said decay response to generate said different resonant frequencies; and

determining said physical parameter from said different resonant frequencies.

9. The method of claim 8 , wherein said analyzing comprises performing as Fourier transform on said decay response to obtain said different resonant frequencies and said determining said physical parameter from said different resonant frequencies comprises calculating said physical parameter from said different resonant frequencies and a coefficient of said different resonant frequencies as a function of said physical parameter.

10. The method of claim 8 , wherein said wireless interrogation signal is tuned to each of said different resonant frequencies of said plurality of MEMS piezoelectric resonators.

11. The method of claim 8 , further comprising dynamically tuning a frequency of said wireless interrogation signal during said wirelessly exciting.

12. The method of claim 8 , wherein said wireless interrogation signal comprises a pulse-modulated sinusoidal radio frequency (RF) signal.

13. The method of claim 8 , wherein pulse-modulated sinusoidal radio frequency (RF) signal is gated in a time domain to provide intervals without said wireless interrogation signal for use during said analyzing.

14. The method of claim 8 , wherein each of said plurality of MEMS piezoelectric resonators is operated as a one port resonator.

15. The method of claim 8 , wherein each of said plurality of MEMS piezoelectric resonators is operated as a two port resonator.

16. The method of claim 8 , wherein said physical parameter comprises, temperature, pressure, stress, or strain.

17. The method of claim 8 , wherein each of said plurality of MEMS piezoelectric resonator is within an enclosed volume.

18. The method of claim 17 , wherein said enclosed volume comprises an inside of an engine or an inside of a tire.