IP Library Granted Patent US 9,666,715
Granted Patent B2
US 9,666,715 · App. 14/599,556 · Granted May 30, 2017

FinFET transistor with epitaxial structures

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Quick Facts
Patent No.
US 9,666,715
App. No.
14/599,556
Granted
May 30, 2017
Kind
B2
Abstract

A field effect transistor with epitaxial structures includes a fin-shaped structure and a metal gate across the fin-shaped structure. The metal gate includes a pair of recess regions disposed on two sides of the bottom of the metal gate.

Claims (15)

1. A field effect transistor with epitaxial structures, comprising:

a fin-shaped structure extending along a first direction, disposed on a semiconductor substrate; and

a metal gate across the fin-shaped structure, wherein the metal gate comprises a pair of recess regions respectively disposed on two sides of a bottom of a lower part of the metal gate, wherein each of the recess regions comprises a vertical region and a slanted region sequentially arranged from a bottom to a top of the recess regions, and a boundary between the vertical region and the slanted region of the recess region aligns with a top surface of the fin-shaped structure, and an upper part of the metal gate and a lower part of the metal gate respectively have a width along the first direction, the width of the upper part of the metal gate greater than the width of the lower part of the metal gate between the pair of the recess regions.

2. The field effect transistor of claim 1 , wherein the metal gate overlaps portions of the fin-shaped structure.

3. The field effect transistor of claim 1 , wherein the metal gate further comprises another vertical region disposed on the slanted region.

4. The field effect transistor of claim 1 , the field effect transistor further comprises a spacer conformally covering the vertical region and the slanted region.

5. The field effect transistor of claim 4 , wherein the spacer covering the vertical region is more inward than the spacer covering the slanted region.

6. The field effect transistor of claim 1 , wherein the metal gate, the vertical region, and the slanted region are along a first axis.

7. The field effect transistor of claim 1 , further comprising two epitaxial structures, respectively disposed on two sides of the metal gate, wherein portions of the epitaxial structures are respectively disposed in the recess regions.

8. The field effect transistor of claim 7 , wherein a top side of each of the epitaxial structures is convex.

9. The field effect transistor of claim 7 , wherein a bottom side and a lateral side of each of the epitaxial structures are convex.

10. The field effect transistor of claim 7 , wherein each of the epitaxial structures is a sphere-like structure.

11. The field effect transistor of claim 1 , further comprising at least two parallel channel regions in the fin-shaped structure, wherein channel lengths of the channel regions are substantially the same.

12. The field effect transistor of claim 1 , wherein the transistor further comprises a spacer conformally covering the metal gate.

13. The field effect transistor of claim 1 , wherein the metal gate comprises a gate dielectric layer, a work function metal layer, and a gate metal layer stacked from the bottom to the top of the metal gate.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 26, 2021
From: UNITED MICROELECTRONICS CORPORATION
To: MARLIN SEMICONDUCTOR LIMITED
Reel/Frame 056991/0292 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 5, 2015
From: WENG, CHEN-YI
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 035792/0031 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 19, 2015
From: CHANG, CHUNG-FU; LIN, CHUN-HSIEN
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 034741/0516 →