Heat spreading substrate with embedded interconnects
View Patent ↗Heat spreading substrate with embedded interconnects. In an embodiment in accordance with the present invention, an apparatus includes a metal parallelepiped comprising a plurality of wires inside the metal parallelepiped. The plurality of wires have a different grain structure than the metal parallelepiped. The plurality of wires are electrically isolated from the metal parallelepiped. The plurality of wires may be electrically isolated from one another.
1. A method comprising:
wire bonding a plurality of wires to a substrate, said plurality of wires being a plurality of bond wires;
filling a volume with an electrically and thermally conductive material, wherein said volume is in contact with said substrate and comprises said plurality of wires,
wherein said electrically and thermally conductive material comprises a different grain structure from that of said plurality of wires.
2. The method of claim 1 further comprising coating said plurality of wires with a dielectric prior to said bonding.
3. The method of claim 1 further comprising placing a plurality of contacts on said substrate.
4. The method of claim 1 further comprising polishing a surface of said electrically and thermally conductive material to expose ends of said plurality of wires.
5. The method of claim 4 wherein said polishing electrically isolates at least two of said plurality of wires.
6. The method of claim 1 wherein said plurality of wires are electrically isolated from said electrically and thermally conductive material.
7. The method of claim 2 further comprising mounting an electronic device on a surface of said electrically and thermally conductive material.
8. The method of claim 7 wherein said electronic device comprises:
first and second differentiated electrical contacts;
wherein said first differentiated electrical contact is electrically coupled to one of said plurality of wires; and
wherein said second differentiated electrical contact is electrically coupled to said electrically and thermally conductive material.
9. The method of claim 8 further comprising:
wire bonding said first differentiated electrical contact to one of said plurality of wires.
10. The method of claim 8 further comprising:
surface mounting said second differentiated electrical contact to said electrically and thermally conductive material.
11. The method of claim 1 wherein said filling comprises placing an electrically and thermally conductive material on said substrate, wherein said electrically and thermally conductive material has pre-existing holes to accommodate ball bonds of said plurality of wires.