Fuse-like sensor, detection and measurement systems

1. A sensor system for structural monitoring, comprising:

a monolithic substrate having a continuous surface;

a patterned insulating layer that is directly written as a plurality of lines disposed over the surface, wherein the plurality of lines is written by additive process only; and

a circuit including a plurality of conductive paths that are directly written over the corresponding plurality of the lines of the patterned insulating layer of the substrate, wherein the plurality of conductive paths is written by additive process only, wherein as-written the conductive paths and the lines of the patterned insulating layer have the same width, wherein the surface is curved or stepped as a three-dimensional contour, wherein the plurality of conductive paths follow a continuous portion of the three-dimensional contour of the surface, and wherein the circuit is configured to:

detect an interruption or alteration of conduction of one or more of the plurality of conductive paths due to a flaw in the substrate, and

identify the interrupted or altered one or more of the plurality of conductive paths based on one or more electrical characteristics of the circuit.

2. The system of claim 1 , wherein each of the plurality of conductive paths is coupled to a first electrode and a second electrode, wherein the flaw in the substrate is a crack or strain beneath the interrupted or altered one or more of the plurality of conductive paths.

3. The system of claim 2 , further comprising a single voltage or current source electrically coupled to the first electrode and the second electrode.

4. The system of claim 2 , further comprising:

an additional conductive path not belonging to the plurality of conductive paths located between the first electrode and the second electrode, wherein, when conduction of the plurality of conductive paths is interrupted and conduction of the additional path is not interrupted, a resistance of the circuit is substantially the same as a resistance of the additional conductive path.

5. The system of claim 1 , wherein at least two of the plurality of conductive paths include a resistor, and wherein the resistors have different resistance such that a total resistance of the circuit identifies the interrupted or altered one or more of the plurality of conductive paths.

6. The system of claim 1 , wherein at least two of the plurality of conductive paths include a capacitor, and wherein the capacitors have different capacitance such that a total capacitance of the circuit identifies the interrupted or altered one or more of the plurality of conductive paths.

7. The system of claim 1 , wherein each of the plurality of conductive paths includes a resistor or a capacitor arranged such that the one or more electrical characteristics of the circuit identify the interrupted or altered one or more of the plurality of conductive paths.

8. The system of claim 1 , wherein the plurality of conductive paths form a multifaceted antenna coil, and wherein the one or more electrical characteristics of the circuit comprise a detectable frequency from the multifaceted antenna coil.

9. The system of claim 1 , wherein the plurality of conductive paths comprise semi-conductive materials.

10. The system of claim 1 , wherein the system is configured to determine a length of the flaw by identifying the interrupted or altered one or more of the plurality of conductive paths.

11. The system of claim 1 , wherein the flaw comprises one or more of a surface crack, elastic deformation of the substrate, or plastic deformation of the substrate.

12. The system of claim 1 , wherein at least a portion of the circuit is printed using a technique selected from the group consisting of aerosol jet direct writing, extrusion printing, ink-jet printing, screen printing, roll printing, gravure printing, and combinations thereof.

13. The system of claim 1 , wherein the conductive paths are disposed directly on the surface of the substrate.

14. The system of claim 1 , wherein the insulating layer is selected from the group consisting of a paint layer, a dielectric layer, a protective coating, and combinations thereof.

15. The system of claim 1 , wherein the system is a structural health monitoring system configured to monitor an object that includes the substrate.

16. The system of claim 15 , wherein the object is one or more of an aircraft component, a building component, a bridge component, or a pipeline component.

17. The system of claim 15 , wherein the structural health monitoring system is configured to determine a life expectancy of the object based on data from the circuit.

18. A sensor system for structural monitoring, comprising:

a monolithic substrate having a continuous surface;

a patterned insulating layer that is directly written as a plurality of lines disposed over the surface, wherein the plurality of lines is written by additive process only;

a capacitive circuit including:

a first conductive electrode that is directly written over one line of the patterned insulating layer, wherein the first conductive electrode is written by additive process only, wherein as-written the first conductive electrode and the one line of the patterned insulating layer have the same width,

a second conductive electrode that is directly written over another line of the patterned insulating layer, wherein the second conductive electrode is written by additive process only, wherein as-written the second conductive electrode and the another line of the patterned insulating layer have the same width, wherein the surface is curved or stepped as a three-dimensional contour, and wherein the first conductive electrode and the second conductive electrode follow a continuous portion of the three-dimensional contour of the surface, and

a deposited dielectric material separating the first electrode and the second electrode, wherein the electrodes and the patterned insulating layer have the same width,

wherein the circuit is configured to detect a change in a capacitance of the capacitive circuit due to a crack propagation in the substrate.