ELECTRICAL CHARGE REGULATION FOR A SEMICONDUCTOR SUBSTRATE DURING CHARGED PARTICLE BEAM PROCESSING
A method for preparing a semiconductor target ( 10 ), the method comprising providing a semiconductor substrate ( 12 ) including a main substrate surface ( 14 ) which defines a substrate periphery ( 20 ) along an outer edge. The semiconductor substrate ( 12 ) further has an structure layer ( 30 ) arranged on the main substrate surface, and comprising a structure layer periphery ( 32 ) that is located inwards with respect to the substrate periphery, so as to leave exposed a peripheral substrate region ( 22 ) along the substrate periphery. The method further comprises applying an electrically conductive layer ( 38 ) on the structure layer, wherein the electrically conductive layer extends beyond the structure layer periphery to establish electrical contact in a contacting portion ( 23 ) of the peripheral substrate region.
1 . A method for preparing a semiconductor target ( 10 ), the method comprising:
providing a semiconductor substrate ( 12 ) including:
a main substrate surface ( 14 ) which defines a substrate periphery ( 20 ) along an outer edge; and
a structure layer ( 30 ) arranged on the main substrate surface, and having a structure layer periphery ( 32 ) that is located inwards with respect to the substrate periphery, so as to define a peripheral substrate region ( 22 ) along the substrate periphery which is not covered by the structure layer;
wherein the method comprises:
applying an electrically conductive layer ( 38 ) onto the semiconductor substrate, including and beyond the structure layer, wherein the electrically conductive layer extends beyond the structure layer periphery to establish electrical contact with a contacting portion ( 23 ) of the peripheral substrate region.
2 . Method according to claim 1 , wherein the semiconductor substrate ( 12 ) comprises a lateral substrate surface ( 18 ) which borders on the main substrate surface ( 14 ) and which delineates the substrate periphery ( 20 ), and wherein applying the electrically conductive layer ( 38 ) on the semiconductor substrate and the structure layer comprises:
extending the electrically conductive layer ( 38 ) towards the lateral substrate surface ( 18 ) to form an electrical contact with at least a portion of the lateral substrate surface.
3 . Method according to claim 1 or 2 , wherein the structure layer ( 30 ) comprises a cover layer ( 36 ), and wherein applying the electrically conductive layer ( 38 ) on the semiconductor substrate ( 12 ) and the structure layer comprises:
applying the electrically conductive layer directly onto the cover layer ( 36 ).
4 . Method according to any one of the claims 1 - 3 , wherein the electrically conductive layer ( 38 ) is applied for establishing an electrically conductive path through the conductive layer ( 38 ) and towards the substrate periphery ( 20 ), allowing a net electrical charge, when received by the substrate surface during a charged particle beam process, to be laterally conveyed towards the outer edge of the semiconductor substrate ( 12 ) for dissipation of the net electrical charge to a remote drain via a contacting structure ( 60 ) external to the semiconductor target ( 10 ).
5 . Semiconductor target ( 10 ), comprising:
a semiconductor substrate ( 12 ), including a main substrate surface ( 14 ) which defines a substrate periphery ( 20 ) along an outer edge;
a structure layer ( 30 ) arranged on the main substrate surface, and comprising a structure layer periphery ( 32 ) that is located inwards with respect to the substrate periphery so as to define a peripheral substrate region ( 22 ) along the substrate periphery which is not covered by the structure layer;
wherein the semiconductor target comprises:
an electrically conductive layer ( 38 ) formed on the structure layer, and extending beyond the structure layer periphery to establish electrical contact with a contacting portion ( 23 ) of the peripheral substrate region.
6 . Semiconductor target ( 10 ) according to claim 5 , wherein the semiconductor substrate ( 12 ) comprises a lateral substrate surface ( 18 ) which borders on the main substrate surface ( 14 ) and which delineates the substrate periphery ( 20 ), wherein the electrically conductive layer ( 38 ) extends towards the lateral substrate surface ( 18 ) and forms an electrical contact with at least a portion of the lateral substrate surface.
7 . Semiconductor target ( 10 ) according to claim 5 or 6 , wherein the semiconductor substrate ( 12 ) comprises a silicon base layer ( 24 ), an insulating substrate layer ( 25 ) arranged on the silicon base layer, and a SOI layer ( 26 ) arranged on the insulating substrate layer.
8 . Semiconductor target ( 10 ) according to claim 7 , wherein the insulating substrate layer ( 25 ) includes an aperture ( 27 ) having an electrically conductive material therein adapted for establishing electrical contact between the silicon base layer ( 24 ) and the SOI layer ( 26 ).
9 . Semiconductor target ( 10 ) according to any one of claims 5 - 8 , wherein the structure layer ( 30 ) comprises one or more device layers ( 34 ).
10 . Semiconductor target ( 10 ) according to any one of claims 5 - 9 , wherein the structure layer ( 30 ) comprises a cover layer ( 36 ), and wherein the electrically conductive layer ( 38 ) is arranged directly on top of the cover layer ( 36 ).
11 . Semiconductor target ( 10 ) according to any one of claims 5 - 10 , wherein a resist layer ( 42 ) is arranged directly on top of the electrically conductive layer ( 38 ).
12 . Semiconductor target ( 10 ) according to any one of claims 5 - 11 , wherein a width (d 2 ) of the contacting portion ( 23 ) is larger than a thickness (d 1 ) of the electrically conductive layer ( 38 ), preferably a factor of 10 5 to 10 6 times larger.
13 . Semiconductor target ( 10 ) according to any one of claims 5 - 12 , wherein the electrically conductive layer ( 38 ) has an electrical sheet resistance below 10 5 Ohms per square.
14 . Semiconductor target ( 10 ) according to any one of the claims 5 - 13 , wherein the electrically conductive layer ( 38 ) is formed for establishing an electrically conductive path through the conductive layer ( 38 ) and towards the substrate periphery ( 20 ), allowing a net electrical charge, when received by the substrate surface during a charged particle beam process, to be laterally conveyed towards the outer edge of the semiconductor substrate ( 12 ) for dissipation of the net electrical charge to a remote drain via a contacting structure ( 60 ) external to the semiconductor target ( 10 ).
15 . Lithography system ( 50 ) for processing a semiconductor target ( 10 ) using a charged particle beam ( 54 ), wherein the lithography system comprises:
a charged particle projector ( 52 ) for projecting the charged particle beam towards a main target surface ( 43 ) of the semiconductor target;
a receptor ( 56 ) including a target support region ( 58 ) for supporting the semiconductor target during processing, and
a contacting structure ( 60 ) provided at a periphery of the target support region and comprising a cutting edge ( 62 ) adapted for engaging with a lateral surface ( 18 ) of the semiconductor target, wherein the cutting edge comprises an electrically conductive material and is adapted for establishing electrical contact with the lateral surface of the semiconductor target.
16 . Lithography system ( 50 ) according to claim 15 , wherein the semiconductor target ( 10 ) is a semiconductor target according to any one of the claims 5 - 14 .