Printed circuit boards including strip-line circuitry and methods of manufacturing same
A printed circuit board includes a first layer stack and a second layer stack coupled to the first layer stack. The first layer stack includes a first electrically-insulating layer, a first electrically-conductive layer, and a cut-out area defining a void that extends therethrough. The first electrically-insulating layer includes a first surface and an opposite second surface. The first electrically-conductive layer is disposed on the first surface of the first electrically-insulating layer. The second layer stack includes a second electrically-insulating layer. The second electrically-insulating layer includes a first surface and an opposite second surface. One or more electrically-conductive traces are disposed on the first surface of the second electrically-insulating layer. The printed circuit board further includes a device at least partially disposed within the cut-out area. The device is electrically-coupled to one or more of the one or more electrically-conductive traces disposed on the first surface of the second electrically-insulating layer.
1. A printed circuit board, comprising:
a first layer stack including:
a first electrically-insulated layer;
a first electrically-conductive layer; and
a cut-out area defining a void that extends through the first layer stack;
a second layer stack coupled to the first layer stack and including a second electrically-insulated layer;
a third electrically-insulated layer disposed in association with the first electrically-conductive layer;
a circuit at least partially disposed within the cut-out area;
a first signal layer disposed between the first and second electrically-insulated layers; and
a second signal layer associated with the third electrically-insulated layer and electrically coupled with the first signal layer by a via hole.
2. The printed circuit board according to claim 1 , wherein the cut-out area extends from the first signal layer to an opening defined in the second signal layer.
3. The printed circuit board according to claim 1 , wherein the second signal layer is disposed on the third electrically-insulated layer and the third electrically-insulated layer is disposed on the first electrically-conductive layer.
4. The printed circuit board according to claim 3 , wherein the first signal layer includes a conductive trace and the second signal layer includes a conductive trace electrically coupled to the conductive trace of the first signal layer through the via hole.
5. The printed circuit board according to claim 1 , wherein the circuit is electrically coupled to the first signal layer.
6. The printed circuit board according to claim 1 , further comprising two devices electrically coupled to one another and disposed in association with the second signal layer.
7. The printed circuit board according to claim 6 , wherein at least one device of the two devices is electrically coupled to the circuit by the first signal layer.
8. The printed circuit board according to claim 1 , wherein the second layer stack further includes a second electrically-conductive layer disposed on the second electrically-insulated layer.
9. The printed circuit board according to claim 8 , further comprising a third layer stack coupled to the second electrically-conductive layer.
10. The printed circuit board according to claim 1 , wherein a height of the circuit is greater than a height of the first layer stack.
11. The printed circuit board according to claim 1 , further comprising at least one gap area disposed in adjoining relation to the cut-out area.
12. The printed circuit board according to claim 11 , wherein the at least one gap area is configured to at least one of physically isolate the circuit from the first electrically-conductive layer or electrically isolate the circuit from the first electrically-conductive layer.