Integrated circuit package with inter-die thermal spreader layers
Integrated circuit (IC) packages with an inter-die thermal spreader are disclosed. A disclosed IC package includes a plurality of stacked dies disposed on a package substrate. A heat spreader is disposed on a top die of the plurality of stacked dies. The IC package further includes a thermal spreader layer disposed adjacent to at least one die of the plurality of stacked dies. The thermal spreader layer may extend out of a periphery of the plurality of stacked dies and may be attached to the heat spreader through a support member.
1. An integrated circuit package, comprising:
a substrate;
a first die mounted over the substrate;
a second die stacked on the first die;
a thermal spreader layer that is interposed between the first die and the second die, wherein the thermal spreader layer is in direct contact with the first and second dies;
a heat spreader that is formed over the second die, wherein the second die includes a through-silicon via that is formed in the second die and that is physically coupled to the heat spreader and wherein the through-silicon via is decoupled from active circuitry on the second die; and
a support member that physically couples the thermal spreader layer to the heat spreader.
2. The integrated circuit package defined in claim 1 , wherein the thermal spreader layer extends out of a periphery of the second die.
3. The integrated circuit package defined in claim 1 , wherein the thermal spreader layer has first and second ends that respectively extend past first and second opposing sides of the second die, and wherein the support member is attached to the first end of the thermal spreader layer.
4. The integrated circuit package defined in claim 1 , wherein the support member has a length that is at least equal to the thickness of the second die.
5. The integrated circuit package defined in claim 1 , wherein the thermal spreader layer overlaps at least a center portion of the first die.