Semiconductor device having polysilicon plugs with silicide crystallites
A semiconductor device includes a field effect transistor structure having source zones of a first conductivity type and body zones of a second conductivity type which is the opposite of the first conductivity type, the source zones adjoining a first surface of a semiconductor die comprising the source and the body zones. The semiconductor device further includes a dielectric layer adjoining the first surface and polysilicon plugs extending through openings in the dielectric layer and electrically connected to the source and the body zones. The polysilicon plugs have silicide crystallites in portions distant to the semiconductor die.
1. A semiconductor device, comprising:
a field effect transistor structure comprising source zones of a first conductivity type and body zones of a second conductivity type which is the opposite of the first conductivity type, the source zones adjoining a first surface of a semiconductor die comprising the source and the body zones;
a dielectric layer adjoining the first surface;
contact plugs extending through openings in the dielectric layer and electrically connected to the source and the body zones, the contact plugs comprising polysilicon;
an impurity source in contact with the contact plugs and distant to the first surface of the semiconductor die, the impurity source containing atoms of a metallic recombination element, the contact plugs embedding and separating silicide crystallites from each other, the silicide crystallites being formed from the atoms of the metallic recombination element and being distributed over the height of the contact plugs and spaced from a semiconductor material of the semiconductor die; and
a metal silicide formed along an interface between the contact plugs and the semiconductor die.
2. The semiconductor device of claim 1 , further comprising trench structures extending from the first surface into the semiconductor die, the trench structures comprising, in a cell area of the semiconductor die, gate electrodes separated by gate dielectrics from the semiconductor die.
3. The semiconductor device of claim 1 , wherein the body zones are provided at a first distance to the first surface and the contact plugs extend into the body zones.
4. The semiconductor device of claim 1 , wherein the body zones comprise extension sections adjoining the first surface, respectively.
5. The semiconductor device of claim 1 , further comprising a drain layer formed in the semiconductor die between the body zones and a second surface of the semiconductor die, wherein the second surface is opposite to the first surface and the drain layer is of the first conductivity type.
6. The semiconductor device of claim 1 , further comprising a drain layer formed in the semiconductor die between the body zones and a second surface of the semiconductor die, wherein the second surface is opposite to the first surface and the drain layer comprises first columns of the first conductivity type and second columns of the second conductivity type, the first and second columns being alternatingly arranged and extending in a vertical direction orthogonal to the first surface.
7. The semiconductor device of claim 6 , wherein the drain layer comprises a drift layer and a substrate layer, the substrate layer having a dopant concentration at least ten times higher than that of the drift layer, and wherein the substrate layer directly adjoins the second surface and the semiconductor device is an IGFET.
8. The semiconductor device of claim 6 , further comprising a collector layer of the second conductivity type between the drain layer and the second surface, and wherein the semiconductor device is an IGBT.
9. The semiconductor device of claim 1 , wherein the silicide crystallites are at least one of a group containing platinum silicide crystallites, vanadium silicide crystallites, palladium silicide crystallites, iridium silicide crystallites and gold silicide crystallites.